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Autotalks and Secure-IC Collaborate on Secure V2X Chipset

Autotalks and Secure-IC Collaborate on Secure V2X Chipset

Autotalks, a leading provider of V2X communication technology, has joined forces with end-to-end cybersecurity developer Secure-IC to bolster the security of its V2X communication chipset. This collaboration aims to fortify V2X technology against potential cyber threats, ensuring the safety and efficiency of...

Published on: April 13, 2024

Valens and Sony Collaborate on A-PHY Integrated Camera Sensor

Valens and Sony Collaborate on A-PHY Integrated Camera Sensor

Valens Semiconductor has partnered with Sony Semiconductor to conduct Electromagnetic Compatibility (EMC) testing on a multi-vendor A-PHY link designed for a Sony A-PHY-integrated image sensor. This collaboration aims to revolutionize the automotive industry by introducing the first sensor with integrated high-speed connectivity,...

Published on: April 13, 2024

Qualcomm Acquires Foundries.io

Qualcomm Acquires Foundries.io

Qualcomm, the US chip giant, has made a significant acquisition by purchasing UK-based embedded software developer Foundries.io. The deal, finalized for an undisclosed sum, marks a strategic move for Qualcomm in expanding its capabilities in the embedded software sector.Foundries.io, a Cambridge-based company,...

Published on: April 13, 2024

Renesas Enhances Quick Connect Studio with Remote Debug and Real-Time Code Customization

Renesas Enhances Quick Connect Studio with Remote Debug and Real-Time Code Customization

Renesas Electronics has recently enhanced its Quick Connect Studio, a cloud-based embedded system design platform, by introducing remote debugging capabilities for boards. This expansion aims to provide users with a more comprehensive toolset to streamline the development process.The Quick Connect Studio by...

Published on: April 13, 2024

Lauterbach Enhances Arm® CoreSight Wire Protocol with Debug/Trace Support

Lauterbach Enhances Arm® CoreSight Wire Protocol with Debug/Trace Support

Customers utilizing Ambarella's CV3 SoCs now have the ability to run Lauterbach's TRACE32® PowerView debug and trace software through the chips' USB 3 interface using the CSWP protocol, a standardized transport protocol that is independent of the physical link. By integrating Arms...

Published on: April 13, 2024

Breakthrough: Tandem Organic Solar Cell Hits 16.94% Efficiency

Breakthrough: Tandem Organic Solar Cell Hits 16.94% Efficiency

Researchers at ICFO have recently achieved a major milestone in the field of solar energy with the fabrication of a new four-terminal organic solar cell featuring a tandem configuration. This innovative device boasts an impressive power conversion efficiency (PCE) of 16.94%. The...

Published on: April 13, 2024

High-Power Industrial-Automotive TVS Devices

High-Power Industrial-Automotive TVS Devices

Introducing innovative space-saving solutions for a variety of applications, Vishay has unveiled the 6DFNxxA, 6DFNxxxCA, T6NxxA, and T6NxxxCA TVS devices. These devices boast a peak pulse power of 600 W at 10/1000 μs and impressively low leakage current down to 1 μA.The...

Published on: April 13, 2024

Enhanced Performance with Multiprotocol Wireless SoCs/MCUs for Matter

Enhanced Performance with Multiprotocol Wireless SoCs/MCUs for Matter

The latest addition to Silicon Labs' lineup is the xG26 family, comprising the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. These cutting-edge devices are specifically engineered to safeguard the Internet of Things (IoT) against the most demanding...

Published on: April 13, 2024

Meta Unveils Next-Gen Custom AI Chip

Meta Unveils Next-Gen Custom AI Chip

Meta has recently unveiled the second generation of its Meta Training and Inference Accelerator (MTIA) custom AI chip. This new chip, developed by Meta (formerly known as Facebook), is specifically designed to cater to memory-bound large language models (LLMs) utilizing transformer frameworks....

Published on: April 13, 2024

UK to Open £1.6m Power Device Packaging Facility

UK to Open £1.6m Power Device Packaging Facility

A new £1.6m packaging facility dedicated to power devices has been officially inaugurated at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales. This state-of-the-art power packaging facility is the first of its kind in the UK, offering an open access...

Published on: April 13, 2024

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