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Lauterbach Enhances Arm® CoreSight Wire Protocol with Debug/Trace Support

Lauterbach Enhances Arm® CoreSight Wire Protocol with Debug/Trace Support

Customers utilizing Ambarella's CV3 SoCs now have the ability to run Lauterbach's TRACE32® PowerView debug and trace software through the chips' USB 3 interface using the CSWP protocol, a standardized transport protocol that is independent of the physical link. By integrating Arms...

Published on: April 13, 2024

Breakthrough: Tandem Organic Solar Cell Hits 16.94% Efficiency

Breakthrough: Tandem Organic Solar Cell Hits 16.94% Efficiency

Researchers at ICFO have recently achieved a major milestone in the field of solar energy with the fabrication of a new four-terminal organic solar cell featuring a tandem configuration. This innovative device boasts an impressive power conversion efficiency (PCE) of 16.94%. The...

Published on: April 13, 2024

High-Power Industrial-Automotive TVS Devices

High-Power Industrial-Automotive TVS Devices

Introducing innovative space-saving solutions for a variety of applications, Vishay has unveiled the 6DFNxxA, 6DFNxxxCA, T6NxxA, and T6NxxxCA TVS devices. These devices boast a peak pulse power of 600 W at 10/1000 μs and impressively low leakage current down to 1 μA.The...

Published on: April 13, 2024

Enhanced Performance with Multiprotocol Wireless SoCs/MCUs for Matter

Enhanced Performance with Multiprotocol Wireless SoCs/MCUs for Matter

The latest addition to Silicon Labs' lineup is the xG26 family, comprising the multiprotocol MG26 SoC, the Bluetooth LE BG26 SoC, and the PG26 MCU. These cutting-edge devices are specifically engineered to safeguard the Internet of Things (IoT) against the most demanding...

Published on: April 13, 2024

Meta Unveils Next-Gen Custom AI Chip

Meta Unveils Next-Gen Custom AI Chip

Meta has recently unveiled the second generation of its Meta Training and Inference Accelerator (MTIA) custom AI chip. This new chip, developed by Meta (formerly known as Facebook), is specifically designed to cater to memory-bound large language models (LLMs) utilizing transformer frameworks....

Published on: April 13, 2024

UK to Open £1.6m Power Device Packaging Facility

UK to Open £1.6m Power Device Packaging Facility

A new £1.6m packaging facility dedicated to power devices has been officially inaugurated at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales. This state-of-the-art power packaging facility is the first of its kind in the UK, offering an open access...

Published on: April 13, 2024

ARM Introduces Ethos U85 to Boost Embedded Transformer AI Models

ARM Introduces Ethos U85 to Boost Embedded Transformer AI Models

Embedded algorithms have been evolving rapidly, transitioning from traditional Digital Signal Processing (DSP) to Convolutional Neural Networks (CNN) and now to transformers. According to Paul Williamson, senior vice president and general manager of the IoT business at ARM, the Ethos U85 was...

Published on: April 13, 2024

RS Introduces Embedded Software Service

RS Introduces Embedded Software Service

Distributor RS is revolutionizing the software development tools industry by offering digital and instant delivery through suppliers Matrix and Segger. This innovative approach is set to transform the way engineers access and utilize software for embedded systems.The embedded software application, introduced by...

Published on: April 13, 2024

Europe’s First Commercial Lithium Production Begins

Europe’s First Commercial Lithium Production Begins

Vulcan Energy Resources has made a significant breakthrough in the European battery supply chain by commencing the production of Lithium Chloride (LiCl), a crucial component for electric vehicles. This milestone marks the first instance of such production in Europe, setting a new...

Published on: April 12, 2024

Williams Shares F1 Tech with Industry

Williams Shares F1 Tech with Industry

Williams, a renowned name in Formula One racing, is expanding its horizons by launching a new venture called Williams Grand Prix Technologies. This new company house aims to leverage the cutting-edge innovation and development technologies that have been honed through years of...

Published on: April 12, 2024

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