Electronic Breaking News

Embedded World honours nine award winners

Embedded World honours nine award winners

Nine companies have been recognized for their outstanding achievements at the Embedded World exhibition in Nuremberg, Germany, this week. The event showcased the latest innovations in embedded systems, with a total of 27 products nominated across nine categories for the prestigious embedded...

Published on: March 12, 2025

Lip-Bu Tan Supports Celestial AI’s $500m Photonic Fabric Milestone

Lip-Bu Tan Supports Celestial AI’s $500m Photonic Fabric Milestone

Celestial AI has recently secured a significant amount of funding, raising $250 million for its innovative Photonic Fabric optical interconnect technology platform. This latest funding round, known as Series C1, was led by Fidelity Management & Research Company and included investments from...

Published on: March 12, 2025

Parasoft supports MISRA-C 2025

Parasoft supports MISRA-C 2025

Parasoft, a software company based in the US, is expediting the release of its C/C++test 2025.1 software in response to the recent publication of the MISRA-C:2025 coding specification tailored for safety-critical systems.One of the key updates in the latest MISRA-C guidelines is...

Published on: March 12, 2025

Lotus tech for self-driving taxis in China

Lotus tech for self-driving taxis in China

CaoCao Mobility has introduced a cutting-edge autonomous driving platform for ride-hailing services, developed in collaboration with Lotus Robotics. The innovative technology is currently undergoing testing in Suzhou and Hangzhou in China, with plans for a global and European rollout by the end...

Published on: March 11, 2025

Infineon integrates Nvidia TAO AI support into PSoC Edge microcontroller

Infineon integrates Nvidia TAO AI support into PSoC Edge microcontroller

Infineon Technologies has recently announced the addition of support that enables Nvidia TAO AI vision models to run on its PSOC Edge microcontroller. The PSoC Edge microcontroller combines an ARM Cortex-M55 core with an Ethos-U55 neural processor unit to provide AI capabilities...

Published on: March 11, 2025

AMD extends lifetime of 5th generation EPYC embedded processors

AMD extends lifetime of 5th generation EPYC embedded processors

AMD has introduced a new line of EPYC 64-bit x86 embedded processors utilizing its fifth generation Zen architecture, boasting an extended operational lifetime. Unlike the previous five-year lifespan, AMD is now targeting the EPYC Embedded 9005 Series CPUs to function for seven...

Published on: March 11, 2025

Real-time ToF depth sensor for 3D long-distance measurements

Real-time ToF depth sensor for 3D long-distance measurements

The Hyperlux ID family of real-time, indirect time-of-flight (iToF) depth sensors recently introduced by onsemi offers high-precision long-distance measurements and 3D imaging of fast-moving objects. These sensors utilize a new proprietary global shutter pixel architecture and onboard storage to capture an entire...

Published on: March 11, 2025

ASML imec Renew Chip Tech Deal in Europe

ASML imec Renew Chip Tech Deal in Europe

Lithography giant ASML has extended its strategic partnership with Belgian R&D lab imec for an additional five years. The renewed agreement places a strong emphasis on enhancing semiconductor technology performance, particularly in high NA lithography, while also focusing on sustainability. This development...

Published on: March 11, 2025

Segger Ferrous Systems Team for Rust Debug

Segger Ferrous Systems Team for Rust Debug

Segger, a company based in Germany, has partnered with Ferrous Systems to leverage the Ferrocene toolchain for the Rust programming language in conjunction with J-Trace streaming trace probes. This collaboration aims to enhance the capabilities of embedded-systems developers by providing detailed insights...

Published on: March 11, 2025

COM Express module for AI and HPC applications

COM Express module for AI and HPC applications

Tria Technologies, an Avnet company, has introduced the Tria™ C6C-RYZ8 COM Express Compact Type 6 module at Embedded World 2025. This new module is powered by the AMD Ryzen™ Embedded 8000 Series processor, offering a significant performance boost compared to previous generations...

Published on: March 11, 2025