Electronic Breaking News

Lumotive raises 45m for AI international push

Lumotive raises 45m for AI international push

Lumotive, a company based in Canada, has successfully closed a $45 million funding round to further develop its groundbreaking programmable optical beam steering metasurface technology. The Series B round was oversubscribed and saw participation from a range of new investors including Swisscom...

Published on: February 20, 2025

Space-Grade 200V GaN FET Gate Driver

Space-Grade 200V GaN FET Gate Driver

Texas Instruments (TI) has introduced a new family of radiation-hardened and radiation-tolerant half-bridge gate drivers specifically designed for 200V gallium nitride (GaN) field-effect transistors (FET). This release marks a significant advancement, particularly for the space industry, as it offers enhanced power efficiency...

Published on: February 20, 2025

UK report urges push on semiconductors

UK report urges push on semiconductors

TechUK has recently updated its Plan for Chips report, marking a significant milestone two years after its initial release. The organization is now advocating for more decisive action to be taken in support of the UK semiconductor industry.The revised report features nine...

Published on: February 20, 2025

Lauterbach joins SOAFEE for software defined vehicle debug

Lauterbach joins SOAFEE for software defined vehicle debug

Debug specialist Lauterbach has recently joined the SOAFEE Special Interest Group with the aim of revolutionizing and expediting the development process of software defined vehicles (SDV). This collaboration marks a significant step towards simplifying and accelerating the advancement of SDV technology.SOAFEE, established...

Published on: February 20, 2025

Fast Photorelays Boost Efficiency in Semiconductor Test

Fast Photorelays Boost Efficiency in Semiconductor Test

Toshiba Electronics Europe GmbH has recently unveiled the TLP3414S and TLP3431S photorelays, designed to enhance semiconductor testing processes significantly. These new photorelays boast high-speed turn-on times that are up to 62% faster than their predecessors, all while maintaining top-notch performance levels. Additionally,...

Published on: February 20, 2025

Touchscreen controllers for large curved automotive displays

Touchscreen controllers for large curved automotive displays

Microchip Technology has introduced the ATMXT3072M1 and ATMXT2496M1 families of touchscreen controllers to support automotive HMI designers in implementing capacitive touch sensing for large, curved displays, as well as emerging OLED and microLED technologies. These single-chip controllers offer up to 112 reconfigurable...

Published on: February 20, 2025

3D Flash Memory Achieves 4.8 Gb/s NAND Interface Speed

3D Flash Memory Achieves 4.8 Gb/s NAND Interface Speed

At the ISSCC 2025 event, KIOXIA and Sandisk made waves with the unveiling of their cutting-edge 3D flash memory technology. This new technology boasts a lightning-fast 4.8Gb/s NAND interface speed, exceptional power efficiency, and increased density. The key innovation behind this 3D...

Published on: February 20, 2025

DC DC converter adds two sided board coating cuts silicone potting

DC DC converter adds two sided board coating cuts silicone potting

TDK has introduced two new options for its 10W CCG isolated DC-DC converter series, specifically designed for use in challenging environments. These options aim to enhance the performance and versatility of the converters, making them suitable for a wide range of applications.One...

Published on: February 20, 2025

Infineon targets Aurix AI vector units for BMS designs

Infineon targets Aurix AI vector units for BMS designs

Infineon Technologies is focusing on integrating the vector processing unit into the upcoming generation of Aurix automotive microcontrollers, specifically targeting AI applications for the battery management system. With the company boasting the largest global market share for automotive microcontrollers, the incorporation of...

Published on: February 20, 2025

EU funding approved for Infineon Dresden smart power fab

EU funding approved for Infineon Dresden smart power fab

The European Commission has given the green light to nearly €1 billion in funding for the Smart Power Fab project by Infineon Technology in Dresden, Germany. This funding falls under the European Chips Act, a significant boost for the semiconductor industry in...

Published on: February 20, 2025