NEC Corporation has developed the Near-RT RIC platform, aimed at enabling an advanced 5G network that supports new user experiences based on AI. This platform delivers flexible and intelligent network control per O-RAN Alliance specifications for vRAN and runs on general-purpose hardware....
Published on: February 21, 2025
Lauterbach has recently announced its collaboration with the SOAFEE Special Interest Group, a partnership aimed at working alongside industry leaders to shape the future of the automotive and Software Defined Vehicle (SDV) industry. This collaboration focuses on simplifying vehicle software development, particularly...
Published on: February 21, 2025
Lumotive, a company based in Canada, has successfully closed a $45 million funding round to further develop its groundbreaking programmable optical beam steering metasurface technology. The Series B round was oversubscribed and saw participation from a range of new investors including Swisscom...
Published on: February 20, 2025
Texas Instruments (TI) has introduced a new family of radiation-hardened and radiation-tolerant half-bridge gate drivers specifically designed for 200V gallium nitride (GaN) field-effect transistors (FET). This release marks a significant advancement, particularly for the space industry, as it offers enhanced power efficiency...
Published on: February 20, 2025
TechUK has recently updated its Plan for Chips report, marking a significant milestone two years after its initial release. The organization is now advocating for more decisive action to be taken in support of the UK semiconductor industry.The revised report features nine...
Published on: February 20, 2025
Debug specialist Lauterbach has recently joined the SOAFEE Special Interest Group with the aim of revolutionizing and expediting the development process of software defined vehicles (SDV). This collaboration marks a significant step towards simplifying and accelerating the advancement of SDV technology.SOAFEE, established...
Published on: February 20, 2025
Toshiba Electronics Europe GmbH has recently unveiled the TLP3414S and TLP3431S photorelays, designed to enhance semiconductor testing processes significantly. These new photorelays boast high-speed turn-on times that are up to 62% faster than their predecessors, all while maintaining top-notch performance levels. Additionally,...
Published on: February 20, 2025
Microchip Technology has introduced the ATMXT3072M1 and ATMXT2496M1 families of touchscreen controllers to support automotive HMI designers in implementing capacitive touch sensing for large, curved displays, as well as emerging OLED and microLED technologies. These single-chip controllers offer up to 112 reconfigurable...
Published on: February 20, 2025
At the ISSCC 2025 event, KIOXIA and Sandisk made waves with the unveiling of their cutting-edge 3D flash memory technology. This new technology boasts a lightning-fast 4.8Gb/s NAND interface speed, exceptional power efficiency, and increased density. The key innovation behind this 3D...
Published on: February 20, 2025
TDK has introduced two new options for its 10W CCG isolated DC-DC converter series, specifically designed for use in challenging environments. These options aim to enhance the performance and versatility of the converters, making them suitable for a wide range of applications.One...
Published on: February 20, 2025