Rigetti Computing in the US has launched its third generation Ankaa-3 quantum computer with an 84qubit processor and aims to have a 100qubit machine next year.The re-designed quantum computer achieves a two-qubit gate fidelity of 99%, halving the previous error rate.Ankaa-3 is...
The kick-off of the ChipNL Competence Centre this week marks an additional impulse to boost the innovation and capabilities of the Dutch semiconductor industryEstablished in alignment with the EU Chips Act, the Centre should advance technological capabilities and foster innovation in the...
Using principles from rocket science, researchers have created carbon with a record-breaking surface areaThe material can soak up about twice the amount of CO2 as current activated carbon materials and has impressive energy-storage capabilities. As you might remember from combining baking soda...
SonicEdge has launched SonicTwin, the first integrated MEMS speaker-microphone in a single package for True Wireless Stereo (TWS) earbuds and headphones.The tiny MEMS speaker-microphone measures just 8- x 4- x 1-mm and combines cutting-edge sound generation and sensing capabilities to set a...
ARIA Sensing has launched “Hydrogen,” a groundbreaking UWB radar SoC that sets a new industry benchmark as the first to offer 3D beamforming with programmable bandwidth up to 1.8 GHz. As a result, Hydrogen can use different center frequencies to operate worldwide...
Honda and Nissan have signed a memorandum of understanding (MOU) to start discussions on a joint holding company. A separate MoU explores a further merger with Mitsubishi.This follows an MOU back in March for a strategic partnership for the era of vehicle...
Rohde & Schwarz has collaborated with Analog Devices (ADI) to create a wide range of tests for gigabit multimedia serial link (GMSL) devices.The GMSL technology from ADI provides a cost-efficient, scalable, and simple SerDes solution designed to improve performance for high-speed video...
Battery maker Agratas has bought a new R&D facility in the UK to serve as its technology hub. The 22,857 sq ft (2,123 sq m) facility at Milton Park, Oxford, will serve as the company’s UK technology hub, further strengthening its global...
Alphawave Semi has shown the industry’s first 64 Gbit/s Die-to-Die (D2D) IP subsystem for the Universal Chiplet Interconnect Express (UCIe).The third generation IP, built on a 3nm process in both standard and advanced packaging at TSMC, follows the most recent Gen2 36...
The technique provides researchers with a powerful tool for controlling magnetism, and could help in designing faster, smaller, more energy-efficient memory chips – MIT news
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