Find ASIC Vendors

Electronic Breaking News

Adaptive optimisation model cuts microgrid requirements

Adaptive optimisation model cuts microgrid requirements

An optimization model developed in South Korea improves microgrid operation with lower edge compute requirements to boost energy efficiency and ensure reliable power supply.Researchers at Incheon National University developed the model to adapt to unexpected changes in power supply and demand, ensuring...

Published on: January 28, 2025

Codasip, RED Semiconductor team for RISC-V AI acceleration

Codasip, RED Semiconductor team for RISC-V AI acceleration

Two of Europe’s leading chip designers, Codasip and RED Semiconductor, have signed a deal to work on AI acceleration technologies using the RISC-V open instruction set architecture.UK-based RED will use the Codasip Studio processor design tools to integrate its VISC technology as...

Published on: January 28, 2025

First universal robotics software platform gets seed funding

First universal robotics software platform gets seed funding

A robotics software company founded in 2020, BOW has closed a £4 million seed round, led by Northern Gritstone, that will be used to build on the the already strong commercial traction to date for its platform and robot-agnostic software development kit...

Published on: January 28, 2025

KD, Keysight on optical automotive Ethernet testing

KD, Keysight on optical automotive Ethernet testing

Fabless semiconductor company KD has announced an agreement with Keysight Technologies to partner on optical parameters measurement including TDFOM based on the IEEE Std 802.3cz physical layer test standard.Keysight and KD have been in close collaboration during the development of the IEEE...

Published on: January 28, 2025

High voltage DC contactor integrates mirror contact

High voltage DC contactor integrates mirror contact

TDK has launched two high voltage contactors, one with an integrated mirror contact and the other with enhanced short-circuit current handling.Both support high reliability switching up to 1000V DC for lithium-ion batteries in traction applications, energy storage systems (ESS) and DC charging...

Published on: January 28, 2025

New chip to solve quantum computing roadblocks

New chip to solve quantum computing roadblocks

The goal is to make quantum computers faster, more efficient, and scalable, enabling them to tackle challenges like drug discovery, cybersecurity, and AIThe European Commission is investing in a groundbreaking quantum chip that combines light and electronics for the first time, promising...

Published on: January 28, 2025

Tiny low-noise low-power chip-scale atomic clock

Tiny low-noise low-power chip-scale atomic clock

Microchip Technology has announced its second generation Low-Noise Chip-Scale Atomic Clock (LN-CSAC), model SA65-LN, in a lower profile height and designed to operate in a wider temperature range, enabling low phase noise and atomic clock stability in demanding conditions.The chip-scale atomic clock...

Published on: January 28, 2025

Sakura-I accelerator proved ready to provide AI in Space

Sakura-I accelerator proved ready to provide AI in Space

Fabless chip company EdgeCortix Inc. (Tokyo, Japan) has said NASA radiation tests on its Sakura-I chip show it is suitable for missions in Earth orbit and on the lunar surface and exceeds the capabilities of rival edge AI accelerators.The part was subjected...

Published on: January 28, 2025

Kontron, Mugler team for 5G AI research network

Kontron, Mugler team for 5G AI research network

A 5G network backbone for more advanced AI research and immersive learning platforms has been deployed at Rosenheim Technical University of Applied Sciences (TH Rosenheim) in Germany.A four year deal between the university, Slovenia’s Kontron and Mugler aims to test out a...

Published on: January 28, 2025

Infineon releases isolated gate driver ICs for EVs

Infineon releases isolated gate driver ICs for EVs

Infineon Technologies AG has introduced new isolated gate driver ICs for electric vehicles to enhance its EiceDRIVER™ family, which have been designed for the latest IGBT and silicon carbide (SiC) technologies. In addition, the gate driver ICs support the new HybridPACK™ Drive...

Published on: January 28, 2025

...

5
10
15

...

89
90
91

...

95
100
105

...