Polar Semiconductor in the US has finalized an agreement to license the robust TS18PM power process from Tower Semiconductor.The deal gives Polar a 180nm Process Design Kit (PDK) for making devices at its automotive qualified 200mm fab in Bloomington, Minnesota. This will...
Published on: January 17, 2025
Alchip Technologies in Taiwan has formally launched its three-dimensional integrated circuit (3DIC) design services.The 3DIC service is aimed at for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications with multiple chips stacked vertically within a single package.The company has...
Published on: January 17, 2025
The US Department of Commerce has announced $1.4bn for three projects and an Advanced Packaging Manufacturing Programme (NAPMP).This is intended to establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States....
Published on: January 16, 2025
Brill Power has launched Battery Management as a Service (BMaaS) for energy storage systems.BMaaS links Brill Power’s Battery Intelligence Platform with the BMS hardware, operating system and cloud analytics under a unified interface. This allows battery integrators and owners to extract all the...
Published on: January 16, 2025
The behavior of a cat rubbing its head against a person, known as bunting, is an expression of affection and is believed to have a healing effect on humans – Tsukuba UniversityIn this study, researchers developed a robot that mimics this bunting...
Published on: January 16, 2025
Researchers at University of Tsukuba have developed an innovative method for rapidly creating laser light sources in large quantities using an inkjet printer that ejects laser-emitting dropletsDisplays for TVs, PCs, and smartphones are continually improving in picture quality, clarity, and energy efficiency....
Published on: January 16, 2025
Kyocera is backing Finnish In-Mold Structural Electronics (IMSE) developer TactoTek with $5m as part of the current $60m funding round.Kyocera is embedded its Haptivity I piezoceramic actuators within IMSE parts to combine force sensing and tactile feedback. Force sensing activates capacitive touch...
Published on: January 16, 2025
Exostiv Labs has added device support for AMD Versal™ Adaptive SoCs to its cutting-edge Exostiv massive FPGA capture and Exostiv Blade deep multi-FPGA capture platforms, including support for the world’s largest FPGA, the AMD Versal Premium VP1902.These platforms for FPGA debug, test...
Published on: January 16, 2025
Troubled semiconductor company Intel Corp. has announced that Intel Capital, its venture capital arm, will become a stand-alone company in the second half of 2025.Intel will remain an investor in what will become an independent investment company that is expected to attract...
Published on: January 16, 2025
Infineon Technologies has formed a new business unit out of its Sensor and Radio Frequency (RF) operations.The SURF (Sensor Units & Radio Frequency) business is part of the Power & Sensor Systems (PSS) division and includes the former Automotive and Multi-market Sense...
Published on: January 16, 2025