Qorvo Expands into Smart Home Connectivity with Matter SoC

Qorvo, a leading provider of innovative semiconductor solutions, has introduced a cutting-edge system on chip (SoC) designed specifically for smart home devices. This new SoC, named QPG6200L, is built to support the latest Matter protocol and utilizes a revolutionary wireless technology developed by Qorvo.

The QPG6200L marks the debut of Qorvo's ConcurrentConnect platform, a low-power wireless connectivity solution that sets new standards in the industry. This advanced wireless technology is capable of supporting multiple protocols including Matter, Zigbee, and Bluetooth Low Energy. Notably, the SoC boasts an incredibly low sleep current of less than 1 µA, which is 30% lower than its competitors. Additionally, it offers a transmit power of up to 10dBm along with antenna diversity for enhanced performance.

Featuring an ARM Cortex-M4F controller core running at speeds of up to 192 MHz, the QPG6200L is equipped with 2 MB of NVM and 336 kB of RAM dedicated to applications. Complementing this core is an M0+ core and real-time MAC responsible for managing the various protocols seamlessly.

One of the standout features of the QPG6200L is its ability to support multiple protocols simultaneously on separate channels. This capability ensures optimal RF performance and reliability, making it ideal for a wide range of consumer IoT applications such as smart lighting, sensors, and home hubs. Moreover, the SoC comes with a built-in secure element and is PSA Certified Level 2, providing enhanced security for IoT devices.

"The QPG6200L reinforces Qorvo's position as a leader in smart home connectivity," stated Marc Pegulu, the general manager of Qorvo's Connectivity Systems business. "With our innovative ConcurrentConnect technology, this SoC not only enhances device performance across different networks but also facilitates a smooth transition to Matter, offering users the best of both worlds without leaving any Zigbee devices behind."

As the demand for smart home devices continues to surge globally, with IDC forecasting sales to reach 1.2 billion units by 2028, Qorvo believes that the QPG6200L will play a pivotal role in supporting the next generation of connected devices. The turnkey design for Matter over Thread simplifies the development process while ensuring robust security and performance throughout the network. Additionally, its PSA Level 2 certification guarantees compliance with stringent security standards to safeguard against common software attacks.

Designed for cost-effective implementation, the QPG6200L features an optimized design with a compact 4x4 QFN32 package and 2-layer PCB support. This design approach aims to provide manufacturers with a streamlined and affordable solution for integrating smart home capabilities into their products.

For those interested in exploring the capabilities of the QPG6200L SoC, samples and development kits are currently available, with full production slated to begin early next year. With its advanced features and robust performance, the QPG6200L is poised to set new benchmarks in the realm of smart home connectivity.