Renesas debuts BLE auto chip

Renesas Electronics has introduced its inaugural automotive-qualified system on chip designed for Bluetooth Low Energy (BLE) applications. The chip boasts a compact design, integrating a 2.4GHz BLE radio transceiver, an ARM M0+ microcontroller, memory, peripherals, and security features within a 22-pin chipscale WFFCQFN package measuring just 3.5 x 3.5 mm. Notably, this chip holds the distinction of being the smallest BLE chip currently available on the market.

The software stack embedded in the DA14533 chip is compliant with Bluetooth Core 5.3 standards, catering to a wide range of applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems. This versatile chip can facilitate innovative designs such as determining wheel positions accurately using techniques like Angle-of-Arrival (AoA) and Angle-of-Departure (AoD), enabling fleet operators to monitor tire pressure, fuel efficiency, and predictive maintenance through cloud-connected Bluetooth LE systems.

Moreover, the chip can be utilized in Advanced Driver Assistance Systems (ADAS) to establish wireless sensor networks that provide crucial data for enhancing vehicle safety. The DA14533 chip builds upon the success of the SmartBond Tiny family of consumer BLE chips, offering extended temperature range operation from -40 to +105°C with AEC-Q100 Grade 2 qualification.

Featuring an integrated DC-DC buck converter, the chip dynamically adjusts the output voltage based on system requirements, resulting in an active system power consumption of only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the power consumption drops significantly to 500nA, ensuring efficient power management and extending the operational life of small-capacity battery-powered systems.

Chandana Pairla, VP of Connectivity Solutions Division at Renesas, expressed optimism about the new automotive-grade device, stating, “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint, and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.” The DA14533 chip requires only six external components, with a single external crystal oscillator (XTAL) serving both active and sleep modes, eliminating the need for a separate oscillator during sleep mode.

Renesas has paired the DA14533 chip with the R-Car H3/M3/E3 SoCs, power management PMICs, and timing devices to create a comprehensive Tire Pressure Monitoring System reference design. The DA14533 chip is currently available, along with the Bluetooth Low Energy SoC Development Kit Pro, which includes a motherboard, daughterboard, and cables to facilitate application software development. The daughterboard is also available separately to streamline the development process.