Revolutionary Flip-Chip Machine Achieves 5x Speed Boost

ITEC, the Dutch assembly equipment spinout of Philips and Nexperia, has made a groundbreaking advancement in semiconductor assembly technology with the development of a flip-chip die bonder that boasts speeds up to 5 times faster than current systems.

The significant increase in speed, allowing for flip-chip die bonding at a rate of 60,000 units per hour, has the potential to drive down assembly costs and accelerate the adoption of this innovative technology, according to ITEC.

The key to this remarkable speed enhancement lies in the utilization of a TwinRevolve design, which employs two rotating heads instead of the traditional XY linear placement method. This cutting-edge design enables the bonder to pick, flip, and place the die with exceptional speed and precision, boasting an accuracy of 5 μm @ 1σ (one standard deviation).

ITEC's TwinRevolve die bonder not only offers unparalleled speed and precision but also opens up new possibilities for a wide range of products that previously found flip-chip assembly too slow and costly. The use of flip-chip packages can lead to more reliable products with lower power consumption and superior high-frequency and thermal management performance compared to traditional wire bonds.

In a strategic move, Nexperia has spun out its semiconductor equipment business, paving the way for ITEC to introduce the revolutionary TwinRevolve technique in the ASAT3 XF die bonder. This advanced system features an autoloader for strip magazines, capable of handling four magazines simultaneously with an option for E142 substrate mapping.

The ASAT3 XF die bonder is designed to accommodate 8- to 12-inch wafers through an automatic wafer change unit equipped with a barcode reader for full die traceability. It also offers auto recipe download via MES interface and SECS/GEM interface for seamless integration into manufacturing processes.

Moreover, the die bonder can be configured with a separate flux screen printer for inline setup or operate as a standalone tool with strip magazine input/output. The machine is equipped with full servo-controlled bond-force/pick-force settings and auto-diagnostics to ensure optimal performance.

Mark van Kasteel, Commercial Director at ITEC, expressed his confidence in the ADAT3 XF TwinRevolve die bonder, stating, “We believe our new system represents a significant leap forward in the manufacturing of advanced flip chips and chiplets, aligning with the future vision for factory operations.”

With its automated features and compact design that requires minimal space, the die bonder contributes to reduced maintenance, operational hours, and energy consumption, ultimately leading to a smaller carbon footprint.

The versatility of the die bonder allows it to handle various types of leadless and leaded packages, including QFN, DFN, HVQFN, SOT, SO, TSSOP, and LGA, with a strip size capacity of 100x300 mm.

Headquartered in Nijmegen, the Netherlands, ITEC is a leading back-end semiconductor equipment manufacturer specializing in high-volume semiconductor production as a trusted partner to Philips and Nexperia. In 2021, ITEC transitioned into a separate legal entity, solidifying its commitment to innovation and excellence in semiconductor assembly technology.

For more information, visit www.itecequipment.com.