Scrona Joins Forces for Digital Ink Innovation

Swiss MEMS print head developer Scrona has announced a new partnership with Electroninks to explore the potential of metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging. This collaboration aims to optimize the use of Electroninks digital ink materials within Scrona's MEMS-based print head technology for semiconductor applications. The joint research and development efforts will be conducted in Scrona's Zürich application lab and a regional technology center in Taiwan.

The Electroninks metal complex inks, which include silver, gold, platinum, nickel, and copper, are versatile materials used in various industries such as printed circuit board (PCB) manufacturing, semiconductor packaging, consumer electronics, wearables, and medical devices. By combining these advanced inks with Scrona's innovative print head technology, the two companies hope to drive innovation in semiconductor manufacturing.

According to Patrick Heissler, CEO of Scrona, the alliance with Electroninks will enable them to explore new possibilities in semiconductor packaging, particularly in areas like RDL repair, fine line metalization, via filling, and 3D interconnects. This collaboration is expected to address the increasing demand for higher performance, device miniaturization, and reliability in the semiconductor industry.

Melbs LeMieux, co-founder and president of Electroninks, emphasized the importance of leveraging cutting-edge EHD print head technology to commercialize advanced semiconductor packaging processes. By working together, the two companies aim to facilitate the adoption of fine line print/repair and RDL metallization solutions, enabling the integration of complex functionalities into compact semiconductor packages.

Scrona is at the forefront of developing multi-nozzle MEMS print heads designed for digital ink printing of semiconductors and microLED displays. Through this collaboration with Electroninks, the companies are poised to advance the capabilities of semiconductor manufacturing and contribute to the ongoing evolution of the industry.