Ultra-compact eMMC memory for AI wearables

Longsys in China has developed an eMMC embedded flash memory module that measures 7.2mm × 7.2mm and is small enough for AI wearable designs

The eMMC is 0.8mm high with 153 solder balls for the interconnect and weighs 0.1g. This compares to the standard form factor of 11.5mm × 13mm eMMC that weighs 0.3mm.

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The drive is packaged and tested at Longsys’ in-house Suzhou Packaging & Testing Base using a new grinding and cutting process to achieve the smaller size. The facility specializes in NAND Flash and DRAM packaging and testing while extending its capabilities to UFS, eMCP, and ePOP series with wafer-level, chip-level, and system-level packaging.

The compact package supports capacities of capacities of 64GB and 128GB and frees up additional space for other internal components for AI wearable designs such as smart glasses, watches, and earphones.

The eMMC uses in-house firmware, it ensures fast device boot-up, seamless AI application performance, and efficient data processing. Additionally, low-power technologies such as intelligent sleep and dynamic frequency scaling significantly reduce energy consumption and extend battery life without compromising performance.