News Archive
HP sets up AI lab with assets of Humane
HP Inc (HPI) has made a significant move in the realm of artificial intelligence by acquiring the assets of startup Humane for a substantial $116 million. This acquisition is aimed at establishing an AI lab within the company, known as HP IQ....
Low power ARM M33 microcontroller family for consumer designs
Renesas Electronics has introduced a new series of low-power microcontrollers designed for consumer equipment, featuring the ARM Cortex-M33 core. The RA4L1 microcontroller family consists of 14 devices that operate at an 80MHz clock speed to optimize power efficiency. These devices come equipped...
Distributed solid state battery boost for tiny drones
A groundbreaking development in battery technology has emerged from collaborative research efforts between teams in the US and France. The innovative chip created by researchers at the University of California San Diego (UC San Diego) and CEA-Leti is designed to control a...
AI enabled tool boosts chip interconnect
Arteris has recently introduced its latest AI-enabled tool for network-on-chip (NoC) interconnect IP, known as FlexGen. This innovative tool is designed to significantly enhance chip design efficiency by up to 10 times, streamlining the process and reducing design iterations from weeks to...
Microsecond Cryo-CMOS Qubit Readout Design with 10x Power Reduction
CEA-Leti, in collaboration with quantum chip developer Quobly in France, has achieved a significant milestone in quantum technology by creating a chip capable of simultaneous microsecond readouts of multiple quantum qubit devices. This breakthrough has resulted in a remarkable 10x reduction in...
US consortium to boost quantum cryo electronics
The Quantum Economic Development Consortium (QED-C) in the US is dedicated to advancing cryogenics in quantum technology to drive innovation and industrial competitiveness. QED-C was established with the goal of identifying gaps in enabling technologies and developing strategies to enhance cryogenics technology...
DIN Rail Power Supply with IO-Link Interface and Display
PULS has introduced a new 480W DIN-rail power supply, the CP20.248-IOL, featuring an IO-Link interface and integrated display. This high-reliability 24 VDC power supply is designed for operation monitoring and remote control. Operators can customize power supply and application data in real-time...
First approval for FR2 mmWave 5G test system
Rohde & Schwarz has achieved a significant milestone by becoming the first company to certify a test system for the latest 5G FR2 millimetre wave wireless technology. This achievement marks a major step forward in the validation of radio resource management (RRM)...
Sandisk to Pursue Emerging Memory Technology
Western Digital Corporation, based in San Jose, California, recently announced its decision to split off its flash memory business, Sandisk Corporation. This strategic move is aimed at allowing Western Digital to focus on its hard disk drive business, while Sandisk will continue...
29m for 6G chiplet packaging line in Finland
VTT in Finland has secured a substantial €29 million funding for the APECS packaging pilot line dedicated to 6G and RF chiplet devices. The Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is among the select pilot lines backed...
Partner with us