News Archive
UK fast tracks e-scooter battery standard to tackle fires
The UK government is fast-tracking development of a new standard for e-bike and e-scooter batteries following a report by the Warwick Manufacturing Group (WMG) at the University of Warwick.The UK’s Office for Product Safety and Standards (OPSS) commissioned WMG to produce the...
Researchers find 49 automotive security holes
The world’s largest zero-day vulnerability discovery contest has found 49 security holes in automotive systems.The Pwn2Own Automotive 2025 competition at Automotive World in Tokyo this week saw cybersecurity researchers from 13 countries came together to discover 49 unique zero-day vulnerabilities across systems...
Gate drivers for hybrid IGBT/SiC EV inverters
Infineon Technologies has launched isolated gate drivers for the latest hybrid IGBT and SiC inverter modules in electric vehicles.The EiceDrivers support Infineon’s latest HybridPACK Drive G2 Fusion module, the first plug and play power module that combines Infineon’s silicon and silicon carbide...
Europe falls behind in digital communications as 6G approaches
Europe is falling behind in digital communications warns the latest State of Digital Communications 2025 report from Connect Europe.Although Europe has made progress in critical areas, investment has fallen for the first time in seven years and it still lags behind global...
How much ‘Moore’ do we need? New technologies for the Extreme Edge!
‘We need to filter out silicon-based technology biases to come up with new computing architectures’ – Emre Ozer, Pragmatics
Cre8Ventures adds videantis to PAVE360 digital twins
Siemens Cre8Ventures has signed a strategic partnership with videantis in Germany for AI digital twin technology in automotive.videantis has developed IP and tools for a highly scalable unified processor for chips with AI to be used in automotive ADAS, autonomous driving, drones, VR...
OKI, Nisshinbo enable 3D integration of thin-film analog ICs into chiplets
OKI in collaboration with Nisshinbo Micro Devices has successfully achieved 3D integration of thin-film analog ICs using Crystal Film Bonding (CFB) technology.CFB can be applied to heterogeneous integration, a technology that combines different semiconductor devices with different process nodes, functions (such as...
Sivers awarded contract for Intelsat SATCOM digitizer program
Sivers Semiconductors announced that it has signed a contract to develop high-performance, low-cost digitizers based on the NXP Layerscape platform for Intelsat’s SATCOM terminals.Sivers and NXP have been long-standing partners in the application of the Layerscape platform to 5G O-RAN applications. This...
SoftBank, Quantinuum team on hybrid quantum computing
Alongside its project Stargate activities, Softbank is working with UK/US firm Quantinuum on hybrid quantum computing systems in data centres.Combining CPUs, GPUs and Quantum Processing Units (QPUs) holds the potential to further extend the capabilities of AI, says Softbank. The combination means...
Portable real-time spectrum analyzers for complex WLAN analysis
The SPECTRAN® V6 MOBILE, just launched by Aaronia, is a portable real-time spectrum analyzer series that enables precise and reliable measurements on site.The tablet spectrum analyzer is the first to use an in-house developed PC board with AMD Ryzen™ 7 Core 8845HS...
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