News Archive
ETH Zurich spinout raises $4.2m to scale trapped ion quantum computer
A spinout of ETH Zurich in Switzerland has raised $4.2m to scale the production of trapped ion quantum computer systems to thousands of qubits.The seed funding round for ZuriQ was led by Founderful with participation from SquareOne, First Momentum Ventures, OnSight Ventures...
Cherry restructures its Peripherals business
Cherry has appointed a new boss for its restructured Peripherals business, with a new plan for pan-European distribution.Alexander Hecker will assume the position of Senior Vice President Global Peripherals on February 2nd after Thierry Ondet, who was originally scheduled to take up...
Made in China 2025
Back in 2015, China announced a ten year plan to accelerate its technology industry called Made in China 2025. Although the phrase has been downplayed since 2018, there has seen almost $2trillion of investment in key technology areas that are now central...
ARM boost in $100bn Stargate data centre project
ARM and its owner Softbank are a key partners in a datacentre infrastructure programme called Stargate.The project, with Nvidia as the chip supplier alongside Microsoft, Oracle and OpenAI, will see an investment of $100bn for a series of data centres starting with...
Wolfspeed launches fourth generation SiC technology
Wolfspeed has launched its fourth generation silicon carbide (SiC) technology platform for power applications.The first two bare die in the 1200V CPM4 family for industrial applications have on resistance of 26mΩ with 90A and 42mΩ with 55mA. This is 20% lower at...
Copper-Diamond composite for AI chip cooling
UK-based Element Six (E6) has developed a copper-diamond composite material that has a high thermal and electrical conductivity for cooling AI chips and GaN RF devices.The Cu-Diamond composite consists of diamond grit in a regular array in copper and has a thermal...
Audio DAC IC with high-definition monaural mode
ROHM has developed the 32-bit D/A converter (DAC) chip as well as an evaluation board designed for flagship devices in the MUS-IC™ series optimized for high-resolution audio playback.The latest product builds on the first generation BD34301EKV MUS-IC™ audio DAC chip, renowned for...
SiC MOSFET platform drives efficiency, cuts system costs
Wolfspeed has introduced its new Gen 4 SiC technology platform, which introduces holistic efficiency improvements to enable reduced system costs and development time while maximizing application lifetime.Engineered to simplify switching behaviors and design challenges commonly experienced in high-power designs, the Gen 4...
1700V SiC MOSFETs, bare die, modules
SemiQ has launched a series of 1700 V silicon carbide (SiC) MOSFETs for medium-voltage high power conversion applications.The 1700 V switching planar D-MOSFETs have a reliable body diode, capable of operation at up to 175oC, with all components tested to beyond 1900...
First 1250V MLCC with 10 nF in 3225 format
TDK has launched the industry’s highest capacity multilayer ceramic capacitors (MLCCs) at 1250V in a 3225 form factor.The 10nF CGA and C MLCC series measures 3.2 x 2.5 x 2.5 mm with C0G characteristics with a Class I dielectric.C0G characteristic products change...
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