News Archive
200mm single crystal for vertical GaN transistors
Toyoda Gosei in Japan has developed a 200mm single crystal wafer of gallium nitride (GaN) for vertical transistors.Building vertical transistors provides higher density power devices over using lateral transistors with a GaN-on-silicon process which can be used on 200mm and 300mm wafers....
Samsung invests in neural sensor startup Pison
Pison® has announced an equity investment from Samsung Venture Investment Corporation (Samsung Ventures), validating its AI-powered neural sensor technology for cognitive health, wellness, and gesture control.Pison pioneered the science of electroneurography (ENG) to help harness the power of the mind along with...
AI-based depth sensor measures tiny objects
Kyocera Corporation has announced a high-resolution AI-based depth sensor for measuring tiny objects that have been difficult to measure using conventional depth-sensing technologies.Kyocera’s new camera delivers record-setting depth measurements with 100 μm resolution at a 10 cm range, even from reflective or...
Aledia opens French $200m microLED display line
Aledia in France has opened a $200m production line for its 3D nanowire microLED displays for augmented reality (AR).The Grenoble-based company has raised €600m over the last ten years with Intel and Ikea as investors and has a €100m pilot line for...
AWS and Honda collaborate on SDVs and GenAI EV charging
Amazon Web Services has announced that Honda Motor Company is collaborating with AWS to transition the company’s automobiles from hardware-based into software-defined vehicles (SDVs).Honda will use its Digital Proving Ground (DPG) platform, a vehicle development environment built on AWS, to help build...
Backscatter WiFi board for ultra low power IoT
HaiLa Technologies in Canada has launched a development platform for ultra low power WiFi using passive backscatter technology.The EVAL2000 development board uses the HaiLa BSC2000 Passive Backscatter on WiFi chip combined with the low power STM32U0 microcontroller from ST Microelectronics.The BSC2000, developed...
18 fabs to start construction in 2025
The semiconductor industry is expected to start the construction of 18 fabs in 2025 according to the latest data from Semi.The new projects in Semi’s latest quarterly World Fab Forecast include fifteen 300mm and three 200mm facilities, the majority of which are expected...
Renesas to develop 100W driverless car controller for Honda
Reneas Electronics is developing a 100W chiplet-based central controller for the next generation of Honda’s driverless car.The chip will combine a 3nm Renesas R-car X5 processor and multiple chiplets, including a custom AI device developed by Honda to provide a performance of...
Intel shows ‘whole vehicle’ platform
Intel has expanded its range of automotive chips to provide what it says is a whole platform for electric software defined vehicles.The company has also signed a deal with Amazon Web Services (AWS) for a virtual design environment running on Intel Xeon...
NXP launches first MCX microcontrollers with dual power domains
NXP Semiconductor has cut the power consumption of its latest MCX microcontroller by a factor of three by using dual power domains for the first time.The dual core MCX L series MCUs use an independent low power sensor management domain for smart...
Partner with us