News Archive
First 3.5D face-to-face packaging for AI processors
Broadcom has combined 3D silicon stacking and 2.5D face-to-face packaging technology for AI processors for the first time.The 3.5D eXtreme Dimension System in Package (XDSiP) technology integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks...
First 3.5D face to face packaging for AI processors
Broadcom has combined 3D silicon stacking and 2.5D face-to-face packaging technology for AI processors for the first time.The 3.5D eXtreme Dimension System in Package (XDSiP) technology integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks...
X-fab grabs $50m cash for Lubbock SiC fab
The roll out of grants for semiconductor plants in the last stages of the US CHIPS Act continues with $50m for the silicon carbide (SiC) power device fab in Lubbock Texas run by X-fab of Belgium.The latest agreements also include $33m for...
Stellantis signs Zeta Energy for lithium sulfur EV batteries
European car maker Stellantis has signed a deal to develop fast charging lithium sulfur batteries that could be lighter and cost less than half the price per kWh of current lithium-ion batteries.The deal with Zeta Energy in the US includes both pre-production...
Intel re-affirms “product-and-foundry” strategy with director appointments
Troubled US chip gaint Intel Corp. has announced that Eric Meurice, former CEO of ASML Holding NV, and Steve Sanghi, chair and interim CEO of Microchip Technology Inc., have been appointed to Intel’s board of directors with immediate effect.Both will serve as...
$27m to roll out diamond cooling for Indian datacentre power
Akash Systems in the US has received a $27m contract to roll out its diamond cooling technology in datacentres in India.The contract will see Akash will deliver its ‘Diamond Cooled servers’ to NxtGen datacentres across India.Akash’s Diamond Cooling is a new cooling solution...
Miniaturized leadless logic saves space
Nexperia has introduced a new series of 64 miniature logic ICs in automotive-qualified MicroPak XSON5 leadless packaging.The AECq-100 devices are used in space constrained automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS).MicroPak XSON5...
Miniaturized leadless logic save space
Nexperia has introduced a new series of 64 miniature logic ICs in automotive-qualified MicroPak XSON5 leadless packaging.The AECq-100 devices are used in space constrained automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS).MicroPak XSON5...
$75m CHIPS Act cash for glass substrates
The last days of the Biden administration in the US has seen an award of $75m to Absolics confirmed for manufacturing of glass substrates for AI chiplet packaging.Absolics, a subsidiary of Korean firm SKC, is building a 120,000 square-foot facility in Covington,...
Samsung, SK Hynix partner on processing-in-memory
Memory chip manufacturers Samsung and SK Hynix are collaborating to standardize processing-in-memory (PIM) in the form of an LP-DDR6 memory, according to Business Korea.The collaboration includes preliminary work to register the standardization of the LP-DDR6-PIM with the Joint Electron Device Engineering Council...
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