News Archive
Samsung and TSMC Collaborate on Next-Gen HBM4 DRAM
Kochpatcharin recently spoke at the Semicon Taiwan 2024 Forum, where it was revealed that Samsung and TSMC have joined forces on memory technology for the first time. This collaboration marks a significant milestone in the industry, bringing together two major players to...
US$10 Billion Indian Fab Gets State Approval for Tower
After years of setbacks and bureaucratic hurdles, Tower Semiconductor is once again making headlines with its ambitious plans to establish a wafer fab in India. The company's proposal, in collaboration with Adani Group, aims to set up a state-of-the-art manufacturing facility in...
IGBT Inventor Awarded $1M Prize
The prestigious 2024 Millennium Technology Prize has been awarded to Professor Bantval Jayant Baliga of North Carolina State University for his groundbreaking invention of the Insulated Gate Bipolar Transistor (IBGT). This technology, developed in the 1980s, has played a crucial role in...
AI Chiplets Boosted by Glass Substrate Alliance
An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.The E-Core Alliance, led by E&R Engineering in Taiwan, has brought together over 15 companies to accelerate the development of large glass substrates....
Advancements in GaN Technology: 300mm Wafer Breakthrough
Shin-Etsu Chemical, a leading company in Japan, has recently unveiled a groundbreaking 300mm (12in) substrate designed specifically for GaN epitaxial growth. This innovative product has already entered the market in the form of samples, marking a significant advancement in the field of...
240W Charger Evaluation Board with Single-Stage PFC
Eggtronic, a company based in Italy, has recently unveiled an innovative evaluation board (EVB) tailored for smaller 240W power delivery (PD) 3.1 applications that require fast charging capabilities.The SmartEgg 240W PD 3.1 EVB charger design, developed by Eggtronic, boasts a peak efficiency...
Theion Launches Solid State Sulfur Battery Center
German battery company theion has recently inaugurated a cutting-edge Technology Centre in Berlin, signaling the commencement of customer evaluation for its innovative sulfur battery cells. Situated in the science and technology park in Adlershof, the theion centre is dedicated to the development...
Stellantis-Foxconn Venture Utilizes Siemens Tools
SiliconAuto, a joint venture of European car maker Stellantis and contract manufacturer Hon Hai Technology (Foxconn), has recently announced its adoption of the PAVE360 software from Siemens Digital Industries Software. This strategic move is aimed at reducing development time for the automotive...
Nokia and CommScope Collaborate on AI-Powered Wi-Fi and Fiber Connectivity
The collaboration between RUCKUS Networks and Nokia brings forth an innovative integrated fiber and Wi-Fi solution tailored to enhance end-user connectivity experiences in various settings such as multi-dwelling units (MDUs), hospitality, large public venues (LPVs), and educational institutions. This cutting-edge offering combines...
LG Partners with Blue Cheetah for AI Chiplet Design
Blue Cheetah Analog Design in the US and LG Electronics have joined forces to develop a cutting-edge generation of chiplets. This collaboration has already seen LG tape out silicon using the Blue Cheetah chiplet interconnect, paving the way for future AI-enabled products....
Partner with us