News Archive

EPC and Innoscience Declare Victory in GaN Patent Battle

EPC and Innoscience Declare Victory in GaN Patent Battle

EPC recently announced that the International Trade Commission (ITC) has confirmed the validity of key EPC patents and found that one patent has been infringed by Innoscience. This development marks a significant milestone in the ongoing legal battle between the two companies.In...

Published on: July 09, 2024

CEO Discusses Ink Jet Printing for Semiconductor Equipment

CEO Discusses Ink Jet Printing for Semiconductor Equipment

Nick Flaherty recently sat down with Patrick Heisler and Patrick Galliker at Scrona as the Swiss startup announced a successful fundraising round of €4m. This investment comes as the company introduces its third generation ink jet print head, aimed at revolutionizing semiconductor...

Published on: July 09, 2024

Fraunhofer Team Develops Compact ‘Green’ Hydrogen Cell

Fraunhofer Team Develops Compact ‘Green’ Hydrogen Cell

In a groundbreaking development, specialists at Fraunhofer have achieved a major milestone in the field of renewable energy with the creation of a tandem module capable of producing solar-generated green hydrogen independently. This achievement is part of the Neo-PEC joint research project,...

Published on: July 09, 2024

Breakthrough: Applied Successfully Implements Copper Wiring on 2nm Node

Breakthrough: Applied Successfully Implements Copper Wiring on 2nm Node

The semiconductor industry is constantly evolving, with companies like Applied Materials leading the way in developing innovative solutions to enhance chip performance. Recently, Applied Materials introduced an enhanced low-k dielectric material aimed at reducing chip wiring capacitance and strengthening logic and DRAM...

Published on: July 09, 2024

Breakthrough: Applied Successfully Implements Copper Wiring at 2nm Node

Breakthrough: Applied Successfully Implements Copper Wiring at 2nm Node

The semiconductor industry is constantly evolving, with companies like Applied Materials leading the way in developing innovative solutions to enhance chip performance. Recently, Applied Materials introduced an enhanced low-k dielectric material aimed at reducing chip wiring capacitance and strengthening logic and DRAM...

Published on: July 09, 2024

Simplified Design with Compact Current Sensors

Simplified Design with Compact Current Sensors

The latest advancements in current sensor technology have revolutionized the way efficiency and reliability are achieved in various systems. These cutting-edge sensors offer improved system protection and a reduced bill of materials when compared to traditional methods such as discrete shunt resistors...

Published on: July 09, 2024

Memory Chip Prices to Increase by 10% in Q3

Memory Chip Prices to Increase by 10% in Q3

The latest market research data suggests that the average selling price (ASP) of DRAM is set to experience a notable increase in the upcoming quarter. Analysts predict a rise of 8 to 13 percent in the ASP of DRAM, with conventional DRAM...

Published on: July 09, 2024

New Common Mode Filter Enhances Automotive Ethernet 10BASE-T1S

New Common Mode Filter Enhances Automotive Ethernet 10BASE-T1S

TDK has introduced a groundbreaking common mode filter designed specifically for automotive Ethernet 10BASE-T1S, achieving Class IV parasitic capacitance in the OPEN Alliance EMC test specification.The TDK ACT1210E Series, measuring 3.2 x 2.5 x 2.5 mm, is now in mass production for...

Published on: July 09, 2024

Microchip Unveils 64-bit MPUs for Embedded Design

Microchip Unveils 64-bit MPUs for Embedded Design

The latest MPUs from Microchip are specifically tailored to meet the demands of real-time, compute-intensive applications like smart embedded vision and machine learning. These cutting-edge technologies are driving the need for enhanced power-efficiency, hardware-level security, and high reliability at the edge.By expanding...

Published on: July 09, 2024

European ASIC Consolidation Ignited by Presto Engineering Deal

European ASIC Consolidation Ignited by Presto Engineering Deal

Dentressangle Capital has entered exclusive talks to acquire ASIC designer Presto Engineering in France as the focus for consolidation of European ASIC design houses.Presto Engineering, based in Meyreuil, specialises in designing and producing ASICs for major players in the manufacturing, healthcare, automotive,...

Published on: July 09, 2024

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