News Archive
CEA-Leti Initiates FAMES Pilot Line Project
CEA-Leti has recently initiated a pilot line dedicated to advancing next-generation low-power and sensor process technologies. Known as the FAMES Pilot Line, this project aims to develop a range of cutting-edge technologies that will shape the future of integrated circuits.The FAMES Pilot...
Efficient 4-in-1 MEMS Sensor Enhances Indoor Air Quality
The BME690 4-in-1 MEMS sensor is a cutting-edge technology that is transforming the way we monitor indoor air quality. This innovative sensor is designed to detect high levels of volatile organic compounds (VOC) commonly found in cleaning products, cooking fumes, and other...
Haila Teams Up with e-peas for Light-Powered Wi-Fi
The landscape of energy storage for Wi-Fi connected wireless sensors is on the brink of a significant transformation, thanks to a groundbreaking demonstration by partners in the field. The partners have unveiled a demonstration that showcases a promising path towards achieving extreme...
Ceva Enhances TinyML Optimized NPUs for AIoT Devices with New IP
As the demand for efficient and specialized AI in IoT devices continues to rise, the market for TinyML is experiencing rapid growth. Research from ABI Research suggests that by 2030, over 40% of TinyML shipments will be powered by dedicated TinyML hardware,...
CEA-Leti Unveils €830m FAMES Pilot Line Project
CEA-Leti, a leading research institute in France, has recently initiated an €830 million pilot line dedicated to advancing next-generation process technologies. Known as the FAMES Pilot Line, this ambitious project aims to develop and implement five innovative sets of technologies, ranging from...
New Low Power MCU Portfolio with Wi-Fi 6/6E and Bluetooth Integration
The latest offering from Infineon Technologies, the flexible MCU platform, is set to revolutionize the IoT industry by accelerating customers’ time-to-market with a range of cutting-edge features. This platform comes equipped with ModusToolbox ™ software, RTOS and Linux host drivers, a fully...
Rohde & Schwarz Joins AI-RAN Alliance for 5G/6G Advancement
The renowned technology company Rohde & Schwarz has reached a significant milestone on its journey towards 6G by becoming a member of the AI-RAN Alliance. This move signifies a deepening of the company's collaboration with industry leaders in the development of AI-native...
Innoscience Seeks USPTO Ruling on Infineon GaN Patent
Infineon's US Patent No. 9,899,481 lies at the center of legal disputes initiated by Infineon against Innoscience in both the United States and Europe. Innoscience Technology Co. Ltd., based in Zhuhai, China, has raised concerns regarding the validity of the patent in...
Enhanced Speech Recognition for Augmented Reality
Augmented reality (AR) technology is rapidly advancing, offering a wide array of possibilities to enhance everyday experiences. At the forefront of this innovation is the potential for AR to revolutionize communication through speech recognition models. Researchers have been exploring the use of...
Tenstorrent Partners with Baya Systems for AI/RISC-V Chiplet Technology
Baya Systems and Tenstorrent have joined forces to revolutionize the world of chiplet technology. Baya’s IP and software flow have empowered Tenstorrent and its partners to analyze, customize, and deploy its intelligent compute platform for current and future workloads. This collaboration aims...
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