News Archive
Cardboard Paper Boosts Radio Frequency Energy Harvesting
The innovative use of waste cardboard paper material for constructing a rectenna has been a subject of recent investigation. Researchers have developed a simple fabrication scheme that allows for easy dismantling of the fabricated objects. The electrical traces in these designs are...
New Large FCBGA Substrate Optimized for Data Centers
FCBGA, short for Flip-Chip Ball Grid Array, is a high-density semiconductor substrate that plays a crucial role in connecting semiconductor chips and package substrates. This innovative technology not only enhances electrical connectivity but also improves thermal characteristics, making it a preferred choice...
Sound Technology Enables Precise Object Movement
Optical tweezers have long been used to manipulate particles by creating a light 'hotspot' to trap them, akin to a ball falling into a hole. However, according to Romain Fleury, head of the Laboratory of Wave Engineering at EPFL, this method faces...
Cadence Enhances System IP Portfolio with NoC Integration for Improved Connectivity
As the demand for larger, more complex Systems on Chips (SoCs) and disaggregated multi-chip systems continues to rise to meet escalating compute demands, the challenge of data delivery within and between silicon components has become increasingly difficult. This challenge impacts power, performance,...
Leti Innovates with Chiplets and Automated Design Tools
CEA-Leti, a leading French research group based in Grenoble, has unveiled a groundbreaking chiplet architecture tailored for the automotive industry. This innovative approach is complemented by the development of cutting-edge automated tools aimed at enhancing design exploration processes.The automotive sector's transition towards...
Samsung Plans to Begin 2nm Production at Texas Fab in 2026: Report
Recent reports suggest that Samsung is gearing up for significant advancements in its semiconductor production capabilities. The company was expected to commence production on Samsung's 4nm node by the end of 2024, as per the report detailing Samsung's plans for a third...
McLaren Urges UK Government Support for Supercar Battery Hub
The United Kingdom has the opportunity to spearhead the electrification of supercar production, according to McLaren Automotive CEO, Michael Leiters. He emphasizes the need for attracting investments into the domestic supply-chain to achieve this goal. Leiters points out that the current UK...
Real-Time Medical AI Data Interconnect with Holoscan Deal
Real-Time Innovations (RTI) has announced a collaboration with Nvidia to enhance real-time data connectivity for the Holoscan software development kit (SDK) in medical applications. This partnership aims to integrate the RTI Connext publish/subscribe real-time data interconnect with Holoscan, enabling developers to create...
VW Teams Up with Rivian to Address Software Challenges
Volkswagen has made a significant move in the electric vehicle market by setting up a joint venture with the innovative startup Rivian to develop software-defined vehicles (SDV). The deal, valued at $5 billion, involves VW investing $3 billion in Rivian over the...
Trident IoT Unveils Zigbee 3.0 Chip and SDK
US startup Trident IoT is making waves in the tech industry with its upcoming launch of a cutting-edge Zigbee wireless chip later this year. The company, founded last year by three experienced engineers well-versed in various protocols such as Zigbee, Z-Wave, Thread,...
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