News Archive
Fraunhofer and EV Collaborate on 300mm 3D Quantum Chip
The EV Group (EVG) has announced a new collaboration with the Fraunhofer IZM-ASSID All Silicon System Integration division to focus on the development and optimization of alternative bonding and debonding technologies for 300mm CMOS and heterogeneous integration applications, including quantum computing.Fraunhofer IZM-ASSID...
Electrovaya Unveils Advanced Solid State Battery Technology
Canadian battery maker Electrovaya is at the forefront of developing innovative solid state battery technology specifically designed for heavy duty electric vehicles. The company's commitment to sustainability and efficiency has led to significant advancements in the field of lithium ion conducting ceramics.Electrovaya's...
Soitec and UMC Collaborate on Groundbreaking 3D RF-SOI Chips
French substrate developer Soitec has joined forces with UMC to pioneer the industry's groundbreaking 3D IC solution tailored for Radio Frequency Silicon-on-Insulator (RF-SOI) technology, specifically designed for 5G and millimeter wave applications.UMC's innovative 3D IC technology for RF-SOI leverages Soitec's engineered wafers...
New Crowdfunding Campaign for Electric 19-Seater Aircraft
French electric aircraft developer Aura Aero is currently in the process of raising funds for its innovative 19-seater aircraft through a crowdfunding campaign. The company is aiming to secure €500,000, which represents 0.2% of its €266 million valuation, to support the detailed...
Alphawave Semi Tapes Out Cutting-Edge 7nm Multi-Protocol I/O Chiplet
Alphawave Semi has achieved a significant milestone by taping out the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s advanced 7nm process. This innovative chiplet integrates Alphawave IP with cutting-edge technologies such as 800G Ethernet, PCI Express 6.0, CXL 3.x, and...
140 GHz Multi-Antenna Transceiver Achieves Sub-THz Breakthrough
Devices supporting mmWave frequencies, antenna systems, and RF transceiver modules for future mobile communications standards or automotive radar applications will share the same characteristics that make them challenging to test. The wide frequency range, greater number of antenna elements, and lack of...
AdaCore Joins Safety-Critical Rust Consortium
AdaCore, a leading provider of software development and verification tools, has announced a groundbreaking collaboration with industry giants to establish the Safety-Critical Rust Consortium. The consortium will focus on advancing the use of the Rust programming language in safety-critical systems, with the...
Samsung Introduces 2nm and 4nm Process Nodes Alongside AI Platform
Empowering AI with state-of-the-art process technologyUnder the theme “Empowering the AI Revolution,” Samsung announced its reinforced process technology roadmap, including two new cutting-edge nodes — SF2Z and SF4U — as well as its integrated Samsung AI Solutions platform harnessing the unique strengths...
Infineon Achieves Milestone with Kulim 200mm SiC Fab Phase 1 Completion
Infineon Technologies has reached a significant milestone by completing the first phase of its 200mm Silicon Carbide (SiC) power fab in Kulim, Malaysia. This achievement marks a crucial step forward in the company's strategic plans for expanding its production capabilities.With the official...
Honda and Mitsubishi Team Up for V2G Venture to Reduce Battery Costs
Honda and Mitsubishi have announced a groundbreaking partnership to establish a 50/50 joint venture company named ALTNA. This new venture will focus on the management and second use of electric vehicle (EV) batteries, incorporating vehicle-to-grid (V2G) technologies. ALTNA is scheduled to commence...
Partner with us