News Archive
Enhanced Thermal Performance with GaN Power Packages for CGD Power ICs
CGD has introduced two innovative packages designed to enhance the performance and flexibility of their ICeGaN GaN power ICs. The DHDFN-9-1 (Dual Heat-spreader DFN) features a thin, dual-side cooled design with wettable flanks for easy optical inspection. With a compact 10- x...
Dense Designs Benefit from PAM4 Signal Delivery via Cable Assemblies
High-speed connectivity is crucial in various industries, and NovaRay cable assemblies are at the forefront of enabling cutting-edge applications. These cable assemblies find applications in datacom, AI/ML, HPC, computer and semiconductor, medical, test and measurement, military/aerospace, and mobile networks. With their exceptional...
Percepio® Tracealyzer® Enhancements for Linux Users
The latest release of Tracealyzer, version 4.9, brings a significant focus on improving the user experience for Linux users. One of the key enhancements is the simplified installation process, which has been made more user-friendly with the introduction of a standalone installation...
Pegatron Certifies ZutaCore’s Direct-to-Chip Liquid Cooling Technology
AI server manufacturer Pegatron has recently announced the certification of the cutting-edge HyperCool direct-to-chip two-phase liquid cooling technology developed by ZutaCore. This innovative technology is capable of efficiently cooling up to 2,800 watts of power, offering a simple deployment process with minimal...
NXP and Vanguard to Construct $8B Analog Wafer Fab in Singapore
VisionPower Semiconductor Manufacturing Company Pte. Ltd. is set to make a significant impact in the semiconductor industry as it announces plans to operate as a foundry specializing in the production of 130nm to 40nm mixed-signal, power management, and analog products. The company...
NXP and Vanguard Partner with TSMC for VSMC 300mm Legacy Fab
NXP Semiconductor and Vanguard International Semiconductor (VIS) have announced a strategic partnership to utilize TSMC process technology for a joint venture 300mm fab named VisionPower Semiconductor Manufacturing Company (VSMC). This collaboration aims to enhance the production of power management and mixed signal...
Tech Startup Secures £3.4m Funding for RF MEMS in Satellite and 5G/6G Tech
Sofant Technologies, a pioneering company, has unveiled a groundbreaking radio platform that promises to revolutionize the landscape of wireless communication systems. This innovative platform is designed to slash power consumption in future wireless systems by an impressive 70%. The company's primary focus...
Isolation Transformer with 8mm Clearance
Bourns, a leading manufacturer of electronic components, has recently introduced its second-generation AECQ-200 High Clearance/Creepage Distance Isolation Power Transformer series.The AEC-Q200 compliant HCT8xxxxEAL is a push-pull high voltage isolation transformer with reinforced insulation designed to handle working voltages up to 800 V...
Tailored RISC-V Core for Efficient Applications
Codasip, based in Munich, has recently unveiled a new RISC-V core that promises significant enhancements in performance and efficiency. The L110 low power embedded processor core boasts up to 50% improvements in performance per watt and a 20% reduction in code size....
AI Smart Ring Empowered by Ambiq Chiplet
Ambiq has joined forces with Bravechip Technology in China to develop an innovative AI chiplet tailored for smart ring designs. This collaboration aims to enhance the functionality and efficiency of smart rings through cutting-edge technology.The Bravechip Artificial Intelligence of Things (AIoT) System...
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