News Archive
TDK Expands Smart Motor Driver Lineup for Automotive Applications
TDK has recently unveiled a new line of automotive smart motor drivers that boast impressive capabilities. These drivers are equipped to handle 4 x 1A peak current and come with an Arm Cortex-M3 processor core, setting a new standard in the industry.The...
New Wireless MCU Modules Support Bluetooth LE 5.4, Thread, and Matter
u-blox recently unveiled a new lineup of four compact wireless MCU modules that are designed to support a range of functionalities including Bluetooth LE 5.4, Thread, Matter, and PSA Certified Level 3 security. These stamp-sized modules are set to revolutionize the world...
New Accelerated RISC-V Core: Edge AI and Cryptography Optimized
Red Semiconductor has made waves in the tech industry with the announcement of RISC-V instruction set extensions and a groundbreaking hardware design tailored for edge AI and cryptography applications in ASICs and FPGAs.The hardware, dubbed 'VISC', represents an accelerated RISC-V core that...
sureCore Transitions SRAM Cores to 16nm FinFET Process
sureCore, a leading low power embedded SRAM IP specialist, has recently unveiled its PowerMiser ultra-low dynamic power memory compiler designed for 16nm processes. This new development is set to empower developers in meeting their power efficiency targets and fully leveraging the capabilities...
US and UK Join Forces on AI Safety with New MoU
The United States and the United Kingdom have taken a significant step forward in their collaboration on artificial intelligence (AI) safety testing. A Memorandum of Understanding (MoU) has been signed between the two countries to work together in developing tests for the...
X-Fab Enhances Optical Sensor Process with BSI Integration
X-FAB Silicon Foundries, the analogue/mixed-signal and specialty foundry, has recently announced the addition of a back-side illumination (BSI) capability to its XS018 180nm CMOS semiconductor process, specifically designed for optical sensors.By incorporating BSI technology, the performance characteristics of imaging devices can be...
Hynix Plans $3.9bn HBM Packaging Plant in Indiana
Hynix, a leading semiconductor manufacturer, has announced plans to construct a cutting-edge HBM packaging plant at the Purdue Research Park in West Lafayette, Indiana. The investment for this state-of-the-art facility is estimated at $3.9 billion, marking a significant milestone for the company's...
Launch of First C-LEO Programme Funding Call for Satellite Communications
The UK Government has initiated the first funding call for its C-LEO programme, aimed at enhancing the country’s satellite communications sector, following its announcement in the recent Spring Budget.With £60 million in funding set to be distributed over the next four years...
Optimised Edge AI and Cryptography with Accelerated RISC-V Core
Red Semiconductor has recently unveiled groundbreaking RISC-V instruction set extensions and a hardware design tailored for edge AI and cryptography applications in ASICs and FPGAs.The newly introduced hardware, named 'VISC', features an accelerated RISC-V core that excels in optimizing complex mathematical algorithms...
Hardware Secure Element Achieves FIPS 140-3 Level 3 Certification
NXP Semiconductors has recently unveiled a new hardware secure element that has been certified to FIPS 140-3. This certification is a significant milestone for the company, as it demonstrates their commitment to providing advanced security solutions for industrial IoT devices.The SE052F, as...
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