News Archive
Introducing the Chip-Scale Package: A Wireless MCU for Bluetooth 5.3 LE
ST has recently unveiled a new wireless microcontroller featuring Bluetooth 5.3 LE software. The microcontroller, known as STM32WB09, comes in a compact 5 x 5mm QFN package and is expected to be available in an even smaller ~2.8 x 3mm chip-scale package....
Cortex-M55 MCU Empowered with AI-at-the-Edge Neural Network Accelerator
n Infineon, a leading semiconductor manufacturer, has recently unveiled a new family of microcontrollers that combines cutting-edge technology to cater to the growing demands of the Internet of Things (IoT) and industrial sectors. This family of microcontrollers integrates an Arm Cortex-M55 core,...
Advanced Through-Hole 600V Brushless Motor Drives for Three-Phase Applications
Toshiba Introduces New Through-Hole Motor Drivers Toshiba is targeting pumps, air conditioning, and fans with its latest 600V three-phase brushless DC motor drivers. The TPD4163K and TPD4164K models come in a 32.8 x 13.5 x 3.525mm 'HDIP30' package, featuring pins on a...
Cadence Introduces Open Source 130nm SkyWater Process PDK for Academia
A PDK for the SkyWater open-source 130 nm process now available in the Cadence VLSI Fundamentals Education Kit A PDK (Process Design Kit) for the SkyWater open-source 130 nm process is now included in the Cadence VLSI Fundamentals Education Kit. This kit...
TI Commences Construction on Utah Fab
Texas Instruments Breaks Ground on New Fab in Utah Texas Instruments (TI) has recently broken ground on a new 300-mm fab in Lehi, Utah. This significant milestone was celebrated with the presence of Utah Governor Spencer Cox and TI CEO Haviv Ilan,...
DigiKey and Ambiq join forces, adding 40K products to line card
n DigiKey has announced its partnership with Ambiq, a specialist in "ultra-low" power ICs, for global distribution. Through this agreement, DigiKey is now stocking Ambiq's Apollo4 Blue Plus SoC, which is designed for always-connected IoT endpoints such as wearables and battery-operated smart...
US Investors Dominate 2023 UK Venture Deals, Outpacing Global Competition
UK Leads in Venture Deals with US Investors In 2023, the United Kingdom emerged as the top destination for venture deals involving US investors, surpassing all other countries, according to a report by Pitch Book. During the year, US investors actively participated...
Cambridge GaN Devices Secures Development Deal with PSU Manufacturer
Cambridge GaN Devices Signs Deal with Chicony Power Technology and Cambridge University Technical Services Power IC company Cambridge GaN Devices (CGD) has signed a deal to develop power adapters and data centre PSUs with Chicony Power Technology of Taiwan, and Cambridge University...
UKSA and JAXA Collaborate for In-Orbit Telemetry Relay Service ‘InRange’
UK and Japan Space Agencies Collaborate on Satellite-Based Launch Telemetry System The UK and Japan space agencies have agreed to develop a satellite-based launch telemetry system for the Japanese H3 launch vehicle. The goal is to provide an in-orbit telemetry relay service...
Arteris and Semidynamics Join Forces to Turbocharge SoC Design
n Arteris, a provider of system IP which accelerates SoC design, and Semidynamics, a provider of fully customizable high bandwidth and high-performance RISC-V processor IP, have partnered to accelerate electronic product innovation for AI, ML, and HPC applications. The partnership supports the...
Partner with us