News Archive
Andes integrates Brainchip neuromorphic AI with RISC-V
BrainChip and Andes Technology have joined forces to integrate Neuromorphic AI IP with RISC-V cores, resulting in a powerful collaboration that promises to advance edge AI capabilities. The Akida AKD1500 chip, built on 22nm FD-SOI technology, has been seamlessly integrated into the...
ETH Zurich develops algorithm for more reliable AI responses
Revolutionizing AI Response Engines: ETH Zurich Researchers Develop Innovative MethodResearchers at the Institute for Machine Learning in the Department of Computer Science at ETH Zurich have made a groundbreaking advancement in the realm of artificial intelligence. They have devised a method to...
High density power module for edge AI
Microchip Technology has introduced a cutting-edge point-of-load 12A power module designed specifically for edge AI applications. The MCPF1412 power module features a 16V VIN buck converter and supports I2C and PMBus interfaces, catering to the unique requirements of edge AI designs.With a...
Mitsubishi and Nanofiber to Develop Quantum Computer Interconnections
Mitsubishi Electric Corporation and Nanofiber Quantum Technologies have announced a collaborative project focused on the development of neutral-atom quantum computer interconnection technologies. The primary objective of this project is to create core optical quantum interface technologies that will combine qubit control and...
Thin Film Pyroelectric Enhances Thermal Sensors
Researchers at MIT have made a breakthrough in the field of thermal sensing by developing a technique to create ultra-thin pyroelectric films that can operate at room temperature. This advancement opens up new possibilities for highly sensitive thermal sensors that can be...
First Quantum Computer for Poland
IQM is making strides in the field of quantum computing by installing a 5-qubit superconducting quantum computer at the Wrocław University of Science and Technology (WUST), marking a significant milestone as the first of its kind in Poland. The IQM Spark machine...
Intel shifts to chiplets for automotive AI
Intel has made a significant advancement in utilizing chiplets for its second generation software-defined vehicle system-on-chip (SoC) device. Unveiled at the Shanghai 2025 Auto Show, this SoC integrates chiplets constructed on various process technologies to offer extensive language model AI support, enhanced...
Ray of Light: Streaming 1.9 Million HD Movies
The Technical University of Eindhoven (TU/e) has recently unveiled a groundbreaking test-bed for super-fast wireless data transfer using infrared light. While data transmission via light is not a new concept, this innovative test environment allows for the transfer of massive amounts of...
Avicena and TSMC Collaborate on Photodetector Arrays for I/O Interconnects
Avicena has announced a collaboration with TSMC to enhance the performance of photodetector (PD) arrays for Avicena’s groundbreaking LightBundle microLED-based interconnects. These LightBundle interconnects are designed to support a shoreline density of over 1-Tbps/mm and extend ultra-high-density die-to-die (D2D) connections to distances...
Microchip MCUs Simplify Analogue Sensor Design
Microchip Technology has introduced the PIC16F17576 MCUs, which are designed to enable devices to capture rapidly changing analogue signals with quick response times and minimal power consumption, making them ideal for battery-operated applications. These MCUs feature integrated low-power peripherals and the ability...
Partner with us