News Archive

Lauterbach launches versatile debug tool

Lauterbach launches versatile debug tool

Lauterbach, a leading provider of embedded debug tools, has introduced the PowerDebug X51, a state-of-the-art solution that builds upon the success of its predecessor, the PowerDebug X50. With a host of new features and enhancements, the PowerDebug X51 sets a new standard...

Published on: March 05, 2025

Ceva ARM Team Up for 5G Satellite Chips

Ceva ARM Team Up for 5G Satellite Chips

Ceva, ARM, and SynaXG have joined forces in a strategic collaboration focused on developing cutting-edge 5G satellite chips. The partnership, unveiled at Mobile World Congress in Barcelona, Spain, brings together the Ceva Penta-5G platform with the ARM Neoverse N2 mid-range core to...

Published on: March 05, 2025

Global LTE-M/NB-IoT Connectivity with Click Add-On Board

Global LTE-M/NB-IoT Connectivity with Click Add-On Board

MIKROE has recently unveiled the LTE IoT 10 Click, a compact add-on board designed to provide reliable LTE-M and NB-IoT connectivity for industrial and commercial IoT applications. This new addition to the extensive mikroBUS™-enabled Click board™ family features the Monarch GM02S, a...

Published on: March 05, 2025

DC DC Converter Module with Parallel Option up to 3kW

DC DC Converter Module with Parallel Option up to 3kW

Gaia Converter, a company based in France, has recently unveiled a cutting-edge 500W isolated DC-DC converter that comes equipped with a brand-new parallel option capable of reaching up to 3kW in power output. This innovative product, known as the MGDM-500/P, is designed...

Published on: March 05, 2025

VTT and IQM launch 50-qubit computer

VTT and IQM launch 50-qubit computer

The VTT research institute and IQM Quantum Computers have completed the development of a 50-qubit superconducting quantum computer.The 50-qubit quantum computer is located at VTT’s premises in Micronova in Espoo, Finland. Its creation marks the culmination of four years of joint development...

Published on: March 04, 2025

Compute Subsystems Enhance AI Platforms

Compute Subsystems Enhance AI Platforms

MIPS has introduced the MIPS Atlas portfolio of compute subsystems, specifically tailored to empower leading automotive, industrial, and embedded technology companies in deploying safe, secure, and efficient Physical AI at the edge. The Atlas portfolio is meticulously designed to offer turn-key enablement...

Published on: March 04, 2025

ST doubles memory in Matter wireless microcontroller

ST doubles memory in Matter wireless microcontroller

STMicroelectronics has recently unveiled its latest wireless microcontroller, the STM32WBA6 series, which boasts doubled memory capacity and support for the Matter and Thread protocols. This integrated microcontroller is designed for use in various connected devices, including wearable healthcare monitors, animal collars, electronic...

Published on: March 04, 2025

AI driven near threshold design for low power microcontroller

AI driven near threshold design for low power microcontroller

STMicroelectronics has leveraged near-threshold design techniques to enhance the energy efficiency of its latest low-power microcontroller series tailored for remote applications.The STM32U3 microcontrollers are specifically designed for low-power applications like utility meters, healthcare devices, and industrial sensors. They come equipped with encryption...

Published on: March 04, 2025

TSMC and Trump to Invest Extra $100 Billion in US

TSMC and Trump to Invest Extra $100 Billion in US

Foundry TSMC has made a significant announcement regarding its investment in semiconductor manufacturing in the US. The company revealed that it will be spending an additional US$100 billion on top of the US$65 billion already committed to building wafer fabs in Phoenix,...

Published on: March 04, 2025

Tria to Launch Five Families of Embedded Modules at Embedded World

Tria to Launch Five Families of Embedded Modules at Embedded World

At its debut at Embedded World, Tria Technologies, an Avnet company, is introducing five new product families of embedded modules powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Tria, a leading module vendor with the largest SMARC® portfolio in the market, is expanding...

Published on: March 04, 2025

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