Japan Invests $300m in Cutting-Edge 2nm R&D

Japan’s Ministry of Economy, Trade and Industry (METI) has allocated $300 million to its Leading-edge Semiconductor Technology Centre (LSTC) in order to develop advanced process technology. The goal is to create a 2nm prototype line by 2025, followed by a volume 2nm process by 2027 and a 1.4nm process by 2028.

The Hokkaido fab of the government-backed startup Rapidus will be responsible for implementing these processes. Rapidus, chaired by former Tokyo Electron boss Tetsuro Higashi, has expressed confidence in its success due to the strong support it has received from the government, overseas partners, and gear makers.

Rapidus has secured backing from eight prominent Japanese companies, including Toyota, Sony, NTT, SoftBank, Kioxia, Denso, NEC, and MUFG Bank. Additionally, it has established technology exchange agreements with IBM, Imec, and Leti for process technology development. Collaborative research initiatives have also been established with the University of Tokyo and the University of Tohoku.

During a news conference in Tokyo, Higashi stated, "We outsource research and development that the government deems necessary but is too risky for the private sector to undertake." This highlights the government's commitment to supporting innovative projects that have the potential to drive technological advancements in the semiconductor industry.

The investment by METI reflects Japan's determination to maintain its position as a global leader in semiconductor technology. By focusing on the development of cutting-edge processes, Japan aims to stay at the forefront of the industry and contribute to the advancement of technology on a global scale.