EU Chip Joint Undertaking Launches Four Pilot Lines

The European Union has unveiled plans for four pilot lines dedicated to advancing semiconductor technologies. These pilot lines, established by the Chips Joint Undertaking (Chips JU), will focus on developing cutting-edge chips below 2nm, low power FD-SOI, chiplets, and wide bandgap devices.

Imec in Belgium will spearhead the development of technologies below 2nm, while the FD-SOI line at CEA-Leti in Grenoble, France, is set to push the boundaries down to 7nm. Tampere University in Finland will host a pilot line for wide bandgap devices like silicon carbide and gallium nitride, while the Advanced Heterogeneous System Integration Pilot Line will be led by Fraunhofer in Germany.

These pilot lines will receive grants for setup, integration, process development, and operational activities. Funding will come from the EU's Horizon Europe and Digital Europe Programme, Member States, and private contributions. Additionally, a call for a virtual Design Platform is currently open to further support innovation in the semiconductor industry.

According to Kari Leino, Chair of the Chips JU Public Authorities Board, "The selection of these pilot lines marks a pivotal moment for Europe's semiconductor industry, showcasing the collective commitment of European states to drive technological innovation." Jari Kinaret, the Executive Director of the Chips Joint Undertaking, added, "This decision represents a significant milestone for Europe's semiconductor industry, and we look forward to the realization of these pilot lines."

William Scanlon, CEO of the Tyndall National Institute, expressed excitement about their participation in the leading-edge and FD-SOI pilot lines. Tampere University, a partner in the WBG Pilot Line, is focusing on developing wide bandgap semiconductors for various applications such as motor control systems, battery management systems, and 5G base stations.

Tampere University's budget for the WBG Pilot Line is €40m, with funding from the Finnish government and the European Commission. President Keijo Hämäläinen highlighted the university's commitment to becoming a hub of semiconductor expertise in Europe. Petri Räsänen, director of Business Tampere's Chips from Tampere programme, emphasized the importance of the pilot line in creating next-generation chip solutions.

The pilot lines will play a crucial role in accelerating process development, testing, and validation of design concepts. They aim to bridge the gap from lab to fab and will be accessible to a wide range of users, including academia, industry, and research institutions. Negotiations are underway to finalize agreements related to the pilot lines by the end of 2024.