CUI Introduces Aluminium and Copper BGA Heat Sinks

The Thermal Management Group at CUI Devices has recently announced the expansion of its line of BGA heat sinks. This development comes in the form of the HSB family of BGA heat sinks, which now offers designers a wider range of options to choose from.

With the HSB family, designers can now select from aluminium or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles. This versatility allows for greater customization and optimization of thermal management solutions in various applications.

All models within the BGA heat sink lineup are rigorously tested under four different conditions for thermal resistance. This comprehensive testing approach simplifies the selection process for designers, enabling them to choose the most suitable heat sink for their specific natural convection or forced air cooled system requirements.

These heat sinks are designed to be compatible with ball grid array (BGA) devices ranging from 8.5 x 8.5 mm up to 69.7 x 69.7 mm. They come in profiles ranging from 5 to 25 mm and offer thermal resistances from 3.45 to 39.1°C/W at 75°C ΔT in natural convection. Additionally, the power dissipation ratings range from 1.92 up to 21.74 W at 75°C ΔT in natural convection, ensuring efficient heat dissipation.

For those interested in acquiring the HSB models, they are readily available for purchase with prices starting at $0.51 per unit for orders of 500 pieces or more through distribution channels. This competitive pricing makes the enhanced BGA heat sinks an attractive option for designers looking to optimize thermal performance within budget constraints.

To further assist designers in their thermal management endeavors, CUI Devices offers a comprehensive Resource Library. This online repository contains a wealth of valuable resources, including blog posts, videos, and detailed information on effectively designing with heat sinks. Designers can access this valuable information at their convenience by visiting the CUI Devices website.