TSMC Trials 2nm Production for Apple, Reports Say

Apple has made a significant move in the semiconductor industry by becoming the first customer for TSMC's 2nm chips. The production flow will involve advanced packaging techniques to create the M5 processor, designed for use in both Mac computers and AI servers. This cutting-edge process will take place at TSMC's Baoshan wafer fab in Hsinchu, Taiwan, marking a milestone in chip manufacturing.

Reports suggest that the 2nm chips entering production could potentially find their way into Apple's future iPhone 17 models, showcasing the company's commitment to pushing the boundaries of technology. The collaboration between Apple and TSMC highlights the importance of innovation and efficiency in the competitive semiconductor market.

Initial trial production is slated to commence in the fourth quarter of 2024, with mass production scheduled for 2025. The decision to start production early is aimed at optimizing yields to meet the demands of Apple and other customers. By securing TSMC's entire initial production capacity at 2nm, Apple is positioning itself at the forefront of technological advancements.

TSMC is set to implement nanosheet gate-all-around (GAA) and back-side power supply (BSPR) technologies in the development of the 2nm chips. These cutting-edge techniques will enhance the performance and efficiency of the chips, setting a new standard for semiconductor manufacturing.

Over the next year, the semiconductor industry is expected to witness intense competition as companies like Intel, Samsung, and TSMC race to bring their 2nm manufacturing processes to fruition. The key challenge lies in improving yield rates, which typically start below 50 percent for new processes and need to reach 80 or 90 percent swiftly. The complexity of modern manufacturing processes adds to the difficulty of achieving high yields in a timely manner.