Cutting-Edge Microdisplay Revolutionizes AR Technology

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have made a significant breakthrough in the field of microdisplay technology. As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), they have developed a cutting-edge semi-transparent microdisplay that is set to revolutionize the world of augmented reality (AR) glasses and similar devices.

The microdisplay created by Fraunhofer is a game-changer in terms of weight and resolution. It is notably lighter than traditional combiner-based optical see-through near-to-eye systems while offering exceptional image quality. This innovative technology will be showcased at the SID Display Week 2024 in San Jose, USA, at the German Pavilion, marking a significant milestone in the advancement of microdisplay technology.

In today's rapidly evolving tech landscape, the demand for AR glasses and see-through systems is on the rise across various industries. To enhance user experience and promote widespread adoption, it is crucial for these devices to be lightweight and user-friendly. Factors such as form factor, battery life, connectivity, app ecosystem, and cost play a pivotal role in determining the success of mobile consumer electronics.

The OLED microdisplay developed by Fraunhofer is perfectly suited for generating images in virtual-reality (VR), augmented-reality (AR), and mixed-reality (MR) applications due to its superior resolution and advanced technology. However, traditional microdisplays are not transparent due to their silicon-based design, necessitating complex optical systems for use in see-through devices. This poses challenges in terms of weight, size, and optical efficiency.

The team of scientists at the Fraunhofer Institute for Photonic Microsystems IPMS boasts extensive experience in pioneering microdisplay technologies and possesses unparalleled expertise in the field. With their groundbreaking semi-transparent OLED-on-silicon microdisplay technology, they are paving the way for innovative optical designs in slim, near-eye optics, offering new possibilities for the industry.

Philipp Wartenberg, Group Manager of IC and System Design at Fraunhofer IPMS, elaborates on the technological advancements: "By leveraging modern silicon CMOS processes on silicon-on-insulator (SOI) wafers, we can implement ultra-thin circuitry layers. Through a specialized IC design and process flow, we can achieve semi-transparent microdisplays transferable onto glass wafers. This approach allows for direct integration of microoptics on the chip, turning the transparent microdisplay into a key optical combiner element, thereby reducing the size of the optical system and enhancing efficiency."

Continuing their quest for innovation, the researchers at Fraunhofer IPMS are dedicated to further enhancing transparency levels. Building upon the success of their initial technology demonstrator, they are prepared to collaborate on customer- and application-specific projects to bring this groundbreaking technology to the market.

For more information, visit Fraunhofer Institute for Photonic Microsystems IPMS.