Exploring ReRAM for AI: CEO Interview with Coby Hanoch of Weebit Nano

Embedded chip developers are currently grappling with a significant challenge as non-volatile flash memory struggles to scale below 28nm, leaving a void in the market with no established alternative. This issue has become more pressing due to the surge in demand for memory driven by the development of in-memory computing and neuromorphic AI architecture on cutting-edge process technologies. Coby Hanoch, CEO of Weebit Nano, highlighted this trend in a recent interview with Nick Flaherty of eeNews Europe.

One promising technology being considered for next-generation microcontrollers is resistive RAM (ReRAM), which Weebit has been diligently developing for almost a decade in collaboration with the French research lab CEA-Leti. Hanoch pointed out the industry shift towards ReRAM, citing TSMC's transition from MRAM to ReRAM in response to customer preferences. This shift underscores the growing momentum behind ReRAM as a viable memory solution.

Weebit's innovative silicon oxide memory technology, positioned between the metal traces on top of the chip, offers a cost-effective alternative that can be seamlessly integrated during the back end of line (BEOL) assembly process. The company's successful collaboration with DB HiTek in Korea has paved the way for the integration of ReRAM technology into their 130nm BCD process, catering to a wide range of applications in consumer electronics, industrial sectors, and IoT devices.

The recent tape out of a demonstration chip on the 130nm bipolar process marks a significant milestone in the technology transfer process between Weebit and DB HiTek. This successful demonstration sets the stage for rigorous testing and qualification procedures, with the aim of making the ReRAM technology production-ready within the coming year. The potential applications of ReRAM in smart power management integrated circuits (PMICs) present exciting opportunities for enhanced performance, security, power efficiency, and cost-effectiveness.

Looking ahead, Weebit's collaboration with DB HiTek will involve the integration of the ReRAM module into the BCD 130nm Process Design Kit (PDK), offering customers the flexibility to utilize standard modules or customize them according to their specific requirements. While Weebit continues to make strides in partnering with foundries like DB HiTek, the company is also engaging with larger players in the industry, such as GlobalFoundries, to promote the adoption of their ReRAM technology.