Intel and UMC Collaborate on 12nm Process in Arizona

Intel and UMC have announced a collaboration to develop a 12nm FinFet process for communication and networking chips. This new process will be installed in three of Intel's Arizona fabs, marking a significant step towards Intel's goal of becoming the world's second-largest foundry by 2030.

Stuart Pann, the head of Intel Foundry Services, expressed his excitement about the collaboration, stating, "This is another important step toward our goal of becoming the world's second-largest foundry by 2030. By partnering with UMC, we can leverage their expertise and resources to accelerate the development of our 12nm FinFet process."

UMC co-president, Jason Wang, also emphasized the significance of this collaboration, saying, "Our collaboration with Intel on a U.S.-manufactured 12 nm process with FinFET capabilities is a step forward in advancing our strategy of pursuing cost-efficient capacity expansion and technology node advancement."

The development and manufacturing of the new 12nm process node will take place in Fabs 12, 22, and 32 at Intel's Ocotillo Technology Fabrication site in Arizona. By utilizing existing equipment in these fabs, the upfront investment requirements will be significantly reduced, leading to optimized utilization.

Production of the 12nm process is expected to commence in 2027. This collaboration between Intel and UMC not only strengthens their positions in the semiconductor industry but also highlights the importance of partnerships in driving technological advancements and achieving cost-efficient capacity expansion.