Intel has made a significant advancement in utilizing chiplets for its second generation software-defined vehicle system-on-chip (SoC) device. Unveiled at the Shanghai 2025 Auto Show, this SoC integrates chiplets constructed on various process technologies to offer extensive language model AI support, enhanced...
Published on: April 23, 2025
The Technical University of Eindhoven (TU/e) has recently unveiled a groundbreaking test-bed for super-fast wireless data transfer using infrared light. While data transmission via light is not a new concept, this innovative test environment allows for the transfer of massive amounts of...
Published on: April 23, 2025
Avicena has announced a collaboration with TSMC to enhance the performance of photodetector (PD) arrays for Avicena’s groundbreaking LightBundle microLED-based interconnects. These LightBundle interconnects are designed to support a shoreline density of over 1-Tbps/mm and extend ultra-high-density die-to-die (D2D) connections to distances...
Published on: April 23, 2025
Microchip Technology has introduced the PIC16F17576 MCUs, which are designed to enable devices to capture rapidly changing analogue signals with quick response times and minimal power consumption, making them ideal for battery-operated applications. These MCUs feature integrated low-power peripherals and the ability...
Published on: April 23, 2025
Andes Technology has partnered with S2C to collaborate on the development of an FPGA-based prototyping system tailored for its latest RISC-V cores with extensions. This strategic alliance leverages S2C’s cutting-edge Prodigy S8-100 FPGA prototyping platform, which is built on the foundation of...
Published on: April 23, 2025
As the world transitions towards renewable energy sources like wind and solar power, the traditional methods of synchronizing power grids face new challenges. The continuous output of alternating current (AC) from large-scale power generators has historically facilitated the synchronization needed for power...
Published on: April 22, 2025
Sandisk Corp. is making significant strides in the realm of memory technology with its innovative approach to 3D-NAND flash memory. The company is positioning this technology as a potential replacement for DRAM-based HBM in AI inference applications. This move marks a strategic...
Published on: April 22, 2025
Ceva recently announced that Nextchip has licensed the NeuPro-M Edge AI NPU IP for its upcoming advanced driver assistance systems. The Ceva-NeuPro-M NPU architecture is specifically designed to accelerate deep learning and machine learning workloads across various applications. Featuring a scalable architecture...
Published on: April 22, 2025
The European Innovation Council (EIC) and Horizon Europe research programme are enhancing their support for startups working on dual-use defence and civilian technologies as part of the newly introduced ReArm plan by the European Commission. The primary goal of this initiative is...
Published on: April 22, 2025
PICMG has released the third revision of the CompactPCI Serial specification (CPCI-S.0 R3.0), which aims to ensure future viability and scalability for many years. CompactPCI Serial was originally developed as an extension of the open CompactPCI® standard to meet the demand for...
Published on: April 22, 2025