Electronic Breaking News

Ultra-thin lightsails for space exploration – inch by inch

Ultra-thin lightsails for space exploration – inch by inch

Researchers from TU Delft and Brown University have collaborated on a groundbreaking project involving nanotechnology-based lightsails. These innovative lightsails have the potential to revolutionize space exploration and experimental physics. The joint report by the two institutions sheds light on the exciting possibilities...

Published on: April 02, 2025

Arm accelerates cloud migration to Neoverse processors

Arm accelerates cloud migration to Neoverse processors

Arm is introducing a range of updates to the cloud migration support provided to developers, making it even easier for developers to accelerate software migration with dedicated resources, community engagement, and direct engineering support.With more Arm-based cloud instances available than ever before,...

Published on: April 02, 2025

Autobalancing MOSFET for 3V supercapacitors

Autobalancing MOSFET for 3V supercapacitors

Advanced Linear Devices Inc. (ALD) has introduced a new dual MOSFET designed specifically for managing the power of 3V supercapacitors. The ALD910030 dual MOSFET is a groundbreaking development that allows for precise voltage and leakage current balancing, expanding the capabilities to support...

Published on: April 02, 2025

Majorana zero modes boost quantum computing

Majorana zero modes boost quantum computing

A research team comprising members from the University of Oxford, Delft University of Technology, Eindhoven University of Technology, and Quantum Machines has achieved a significant breakthrough in enhancing the stability of Majorana zero modes (MZMs) within engineered quantum systems. This advancement represents...

Published on: April 02, 2025

Accurate grid modelling boosts EV charger rollout

Accurate grid modelling boosts EV charger rollout

Electric vehicle (EV) adoption is on the rise, and with it comes the need for an extensive network of charging points. However, the addition of thousands of new EV charge points across the UK poses challenges for grid operators in managing energy...

Published on: April 02, 2025

Quantum Computing vs IoT Security

Quantum Computing vs IoT Security

Avishay Shraga, CTO and Head of Security Technologies at chip designer Sony Semiconductor Israel, is advocating for the implementation of a quantum-resistant standard for low power applications within the Internet of Things (IoT). According to Shraga, the current generation of quantum-safe algorithms...

Published on: April 02, 2025

Miromico partners with Panasonic for IoT solar cell

Miromico partners with Panasonic for IoT solar cell

Panasonic has collaborated with Swiss IoT equipment maker Miromicro to develop a customised solar cell for an industrial sensor system. The miro Insight Lux sensor is designed to monitor indoor air quality with precision, utilizing NDIR technology to detect CO2 levels, as...

Published on: April 02, 2025

Frontgrade Gaisler to commercialise neuromorphic AI for space

Frontgrade Gaisler to commercialise neuromorphic AI for space

The Swedish National Space Agency (SNSA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space missions, a contract to commercialize the first neuromorphic System on Chip (SoC) device for space applications. The device, currently under development at Frontgrade Gaisler,...

Published on: April 02, 2025

Dual Channel Interface for 10BASE-T1S Analysis

Dual Channel Interface for 10BASE-T1S Analysis

Vector Informatik, a leading company in Germany, has recently introduced a cutting-edge product to the market - the compact dual channel Automotive Ethernet 10BASE-T1S interface. This innovative interface is equipped with support for the Open Alliance TC10 power management protocol and offers...

Published on: April 01, 2025

3D Photonic Chip Achieves Record 114 Tbps Optical Bandwidth

3D Photonic Chip Achieves Record 114 Tbps Optical Bandwidth

Lightmatter has introduced Passage™ M1000, a revolutionary 3D photonic chip specifically designed for next-generation XPUs and switches, boasting an impressive 114 Tbps of total optical bandwidth to meet the demands of AI infrastructure applications. This groundbreaking chip, spanning over 4,000 square millimetres,...

Published on: April 01, 2025