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Electronic Breaking News

New SMARC 2.1 Module Integrates NXP i.MX95 Processor

New SMARC 2.1 Module Integrates NXP i.MX95 Processor

congatec, a leading technology company based in Germany, has recently unveiled its latest computer-on-modules (COMs) featuring the powerful i.MX 95 processors from NXP Semiconductors. The conga-SMX95 SMARC modules represent a significant leap in performance compared to the previous i.MX8 M Plus modules,...

Published on: July 09, 2024

Cutting-Edge RISC-V Processor and TSN Switch for AI Space Applications

Cutting-Edge RISC-V Processor and TSN Switch for AI Space Applications

Microchip is making significant strides in the field of space technology by qualifying an eight-core fault-tolerant RISC-V processor designed specifically for artificial intelligence applications in space. The radiation-tolerant PIC64-HSPC octal core 1.2GHz switch, boasting 26K DMIPS, is constructed on a 12nm FINFET...

Published on: July 09, 2024

Microchip Launches 64-bit PIC64 Family with RISC-V Architecture

Microchip Launches 64-bit PIC64 Family with RISC-V Architecture

Microchip has recently introduced its inaugural 64-bit microprocessor line, debuting with a multicore RISC-V cluster for the PIC64GX family. The PIC64 GX1000 utilizes the existing RISC-V four-core cluster, accompanied by a fifth microcontroller serving as a system monitor from the PolarFire FPGA...

Published on: July 09, 2024

Communication Breakdown: My Car Doesn’t Understand Me!

Communication Breakdown: My Car Doesn’t Understand Me!

When embarking on a journey, receiving warnings and instructions from your vehicle can significantly impact your experience. Imagine a scenario where your car alerts you, "Warning, if you keep reading now, you may become nauseous on the winding stretch of road. In...

Published on: July 09, 2024

Aviat Networks Acquires 4RF, a Specialist in Industrial Wireless Access

Aviat Networks Acquires 4RF, a Specialist in Industrial Wireless Access

Aviat Networks has made a strategic move by acquiring 4RF, a leading provider of narrowband radios and LTE/5G routers designed for critical infrastructure wireless networks. The 4RF family of products is tailored for industries such as utilities, oil and gas, mining, public...

Published on: July 09, 2024

Vybium’s Stealth Project: European RISC-V AI Accelerator in Development

Vybium’s Stealth Project: European RISC-V AI Accelerator in Development

European startup Vybium is making waves in the semiconductor industry with its innovative approach to developing an AI accelerator chip using the open RISC-V instruction set architecture. This move is seen as a direct challenge to the dominance of the Nvidia A100...

Published on: July 08, 2024

Jetson AGX Xavier GPU Powers Smallest Rugged AI System

Jetson AGX Xavier GPU Powers Smallest Rugged AI System

Aitech Systems has introduced a groundbreaking compact and rugged AI system, the A178-AV, which is equipped with cutting-edge technologies such as CoaXPress (CXP), MIL-STD 1553, ARINC429, and a Real-Time OS.The A178-AV boasts two dedicated NVDLA (Nvidia Deep-Learning Accelerator) engines that serve as...

Published on: July 08, 2024

Europe Offers Free Samples of Latest ST Chips

Europe Offers Free Samples of Latest ST Chips

UK distributor Anglia Components is making it easier for customers in the UK and EU to access the latest STMicroelectronics (ST) semiconductor products. Through their Ezysample service, Anglia will ship sample quantities of every ST NPI (New Product Introduction) free of charge.This...

Published on: July 08, 2024

5G Technology Under Investigation in North Sea by TNO

5G Technology Under Investigation in North Sea by TNO

In a groundbreaking project funded by the Rijkswaterstaat Corporate Innovation Programme, partners are embarking on specific research to address the necessary innovations of 5G technology at sea and the challenges associated with it. This initiative aims to explore how 5G can revolutionize...

Published on: July 08, 2024

Silicon Valley Welcomes Ten Teams for Packaging R&D Center

Silicon Valley Welcomes Ten Teams for Packaging R&D Center

Ten US and Japanese companies have joined forces to establish the US-JOINT Consortium, aimed at constructing a cutting-edge packaging R&D plant to develop next-generation semiconductor packaging technologies. Leading the consortium is Resonac, a Japanese materials firm formerly known as Showka Denko, with...

Published on: July 08, 2024

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