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Enhanced Security with Crypto-Agile FPGA Control

Enhanced Security with Crypto-Agile FPGA Control

Lattice Semiconductor has recently unveiled a cutting-edge secure control FPGA, the MachXO5D-NX, equipped with agile cryptography support. This new FPGA family, based on Nexus technology, is accompanied by the Sentry software stack. The primary focus of these innovations is to cater to...

Published on: June 27, 2024

7nm FDSOI: Ready for Launch

7nm FDSOI: Ready for Launch

Nick Flaherty recently had the opportunity to sit down with Leti CEO Sébastien Dauvé and CTO Jean-René Lèquepeys during the Innovation Days to discuss the latest developments in the semiconductor industry. The focus was on the FAMES pilot line, 6G, quantum computing,...

Published on: June 27, 2024

Cutting-Edge Colored Solar Panels for Building Energy Efficiency

Cutting-Edge Colored Solar Panels for Building Energy Efficiency

Photovoltaic systems have not traditionally been a popular design feature among architects and building owners. However, researchers at Fraunhofer ISE in Freiburg, including Dr. Oliver Höhn, Dr. Thomas Kroyer, and Andreas Wessels, are aiming to change that perception. Their innovative approach involves...

Published on: June 27, 2024

Infrared VCSEL Laser: LED-Like Performance

Infrared VCSEL Laser: LED-Like Performance

Rohm, a leading technology company, has introduced a groundbreaking infrared light source that incorporates a VCSEL (Vertical Cavity Surface Emitting Laser) element within a resin optical diffusion material. This innovative product, known as the Rohm VCSELED, is designed to revolutionize automotive Driver...

Published on: June 26, 2024

Cardboard Paper Boosts Radio Frequency Energy Harvesting

Cardboard Paper Boosts Radio Frequency Energy Harvesting

The innovative use of waste cardboard paper material for constructing a rectenna has been a subject of recent investigation. Researchers have developed a simple fabrication scheme that allows for easy dismantling of the fabricated objects. The electrical traces in these designs are...

Published on: June 26, 2024

New Large FCBGA Substrate Optimized for Data Centers

New Large FCBGA Substrate Optimized for Data Centers

FCBGA, short for Flip-Chip Ball Grid Array, is a high-density semiconductor substrate that plays a crucial role in connecting semiconductor chips and package substrates. This innovative technology not only enhances electrical connectivity but also improves thermal characteristics, making it a preferred choice...

Published on: June 26, 2024

Sound Technology Enables Precise Object Movement

Sound Technology Enables Precise Object Movement

Optical tweezers have long been used to manipulate particles by creating a light 'hotspot' to trap them, akin to a ball falling into a hole. However, according to Romain Fleury, head of the Laboratory of Wave Engineering at EPFL, this method faces...

Published on: June 26, 2024

Cadence Enhances System IP Portfolio with NoC Integration for Improved Connectivity

Cadence Enhances System IP Portfolio with NoC Integration for Improved Connectivity

As the demand for larger, more complex Systems on Chips (SoCs) and disaggregated multi-chip systems continues to rise to meet escalating compute demands, the challenge of data delivery within and between silicon components has become increasingly difficult. This challenge impacts power, performance,...

Published on: June 26, 2024

Leti Innovates with Chiplets and Automated Design Tools

Leti Innovates with Chiplets and Automated Design Tools

CEA-Leti, a leading French research group based in Grenoble, has unveiled a groundbreaking chiplet architecture tailored for the automotive industry. This innovative approach is complemented by the development of cutting-edge automated tools aimed at enhancing design exploration processes.The automotive sector's transition towards...

Published on: June 26, 2024

Samsung Plans to Begin 2nm Production at Texas Fab in 2026: Report

Samsung Plans to Begin 2nm Production at Texas Fab in 2026: Report

Recent reports suggest that Samsung is gearing up for significant advancements in its semiconductor production capabilities. The company was expected to commence production on Samsung's 4nm node by the end of 2024, as per the report detailing Samsung's plans for a third...

Published on: June 26, 2024

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