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Electronic Breaking News

PCIM 2024: Latest News Highlights

PCIM 2024: Latest News Highlights

The PCIM power electronics exhibition in Nuremberg this week was a resounding success, with 637 exhibitors, 60% of which were international, showcasing their latest products and innovations to over 18,000 visitors. This marked a significant increase from the 16,500 attendees last year...

Published on: June 15, 2024

New 1400V IGBT and 1200V Launch by WeEn Semiconductors

New 1400V IGBT and 1200V Launch by WeEn Semiconductors

WeEn Semiconductors, a power spinout from NXP, has recently introduced a new range of IGBTs with voltage ratings of 650V and 1200V, with plans for a 1400V version in the pipeline. The 1200V IGBT devices unveiled at the PCIM event this week...

Published on: June 14, 2024

New Edge AI Chip Enhances Battery Management Models

New Edge AI Chip Enhances Battery Management Models

Eatron Technologies has taken a significant step forward in battery management technology by leveraging the latest edge AI system on chip from Syntiant. The Eatron Intelligent Software Layer, powered by the ultra-low power NDP120 Neural Decision Processor, is at the core of...

Published on: June 14, 2024

IDC Predicts Strong Growth in 2024 Smartphone Shipments

IDC Predicts Strong Growth in 2024 Smartphone Shipments

The smartphone market is set to experience significant growth in the coming years, according to a market analyst. The growth in 2024 is expected to add momentum to an overall recovery in consumer demand following a few dismal years post-COVID. Looking ahead,...

Published on: June 14, 2024

Korea’s AI Leaders Rebellions and Sapeon to Merge

Korea’s AI Leaders Rebellions and Sapeon to Merge

Rebellions is poised to take the lead in an upcoming merger, with the financial specifics remaining undisclosed at this time. The CEO of Rebellions, Park Sung-hyun, is expected to assume the role of CEO in the merged entity, although a definitive name...

Published on: June 14, 2024

Korea’s AI Leaders Rebellions and Sapeon to Merge

Korea’s AI Leaders Rebellions and Sapeon to Merge

Rebellions is poised to take the lead as the senior partner in an upcoming merger, although specific financial terms have not been disclosed. The CEO of Rebellions, Park Sung-hyun, is expected to assume the role of CEO in the merged entity. However,...

Published on: June 14, 2024

Echion Secures £29m for Niobium Battery Technology

Echion Secures £29m for Niobium Battery Technology

Echion Technologies, a UK-based company, has recently announced a successful fundraising round amounting to £29 million (€35 million, $37 million) to support the development of its innovative niobium-based fast-charging battery material.This significant funding injection will allow Echion to ramp up the production...

Published on: June 14, 2024

Fraunhofer and EV Collaborate on 300mm 3D Quantum Chip

Fraunhofer and EV Collaborate on 300mm 3D Quantum Chip

The EV Group (EVG) has announced a new collaboration with the Fraunhofer IZM-ASSID All Silicon System Integration division to focus on the development and optimization of alternative bonding and debonding technologies for 300mm CMOS and heterogeneous integration applications, including quantum computing.Fraunhofer IZM-ASSID...

Published on: June 14, 2024

Electrovaya Unveils Advanced Solid State Battery Technology

Electrovaya Unveils Advanced Solid State Battery Technology

Canadian battery maker Electrovaya is at the forefront of developing innovative solid state battery technology specifically designed for heavy duty electric vehicles. The company's commitment to sustainability and efficiency has led to significant advancements in the field of lithium ion conducting ceramics.Electrovaya's...

Published on: June 14, 2024

Soitec and UMC Collaborate on Groundbreaking 3D RF-SOI Chips

Soitec and UMC Collaborate on Groundbreaking 3D RF-SOI Chips

French substrate developer Soitec has joined forces with UMC to pioneer the industry's groundbreaking 3D IC solution tailored for Radio Frequency Silicon-on-Insulator (RF-SOI) technology, specifically designed for 5G and millimeter wave applications.UMC's innovative 3D IC technology for RF-SOI leverages Soitec's engineered wafers...

Published on: June 13, 2024

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