Europe’s Chip Strengths Unveiled at Leti Innovation Days

The Leti Innovation Days for 2024 marked a significant milestone with the launch of a groundbreaking €830m pilot line dedicated to the development of the next generation of low-power 5G and 6G RF and system chips utilizing FD-SOI technology. This initiative, one of four similar lines established across Europe, has captured the attention of industry experts and enthusiasts alike.

During the event, eeNews Europe had the opportunity to sit down with Leti's CEO Sébastien Dauvé and CTO Jean-René Lèquepeys to delve into the specifics of this ambitious project. Discussions revolved around the advanced equipment already in place, such as the cutting-edge ASML immersion lithography systems, and plans for the integration of EUV technology for the 7nm FD-SOI process.

Moreover, Leti Innovation Days served as a convergence point for leading technologists from Europe and beyond who collaborate closely with the esteemed French research institute. The spectrum of innovations showcased was diverse, ranging from a portable CT x-ray scanner developed in partnership with Thales to the latest optical interconnect solutions for the Cerebras AI supercomputer, and the innovative heterogeneous chiplet technologies that are reshaping the landscape of system development.

Notably, long-standing partner STMicroelectronics unveiled a strategic restructuring plan aimed at aligning the company with the demands of the AI era. This comprehensive transformation spans various facets of the business, encompassing chip design, intellectual property, manufacturing processes, and packaging strategies.

Furthermore, the event provided a platform to spotlight some of the cutting-edge technologies emerging from Leti's labs. These include cyber-secure systems capable of detecting side-channel attacks initiated by lasers, novel approaches to optimizing solar panel output by eliminating the need for inverters, and collaborative efforts with four quantum computing firms based in France.