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Electronic Breaking News

US Demand Revives Global Chip Market in April

US Demand Revives Global Chip Market in April

The global chip market, assessed as a three-month moving average (3MMA), reached a value of US$46.43 billion in the latest data, showing a significant increase of 15.8 percent from April 2023. This growth trend was particularly notable in the Americas chip market,...

Published on: June 08, 2024

MOSFET Integrates Temperature Sensor for Enhanced Functionality

MOSFET Integrates Temperature Sensor for Enhanced Functionality

Infineon Technologies has introduced a groundbreaking 600V Superjunction MOSFET, the CoolMOS S7TA, featuring an integrated temperature sensor tailored for automotive power management applications. This cutting-edge technology is designed to cater to the specific demands of automotive electronics, enhancing accuracy in junction temperature...

Published on: June 07, 2024

Keysight and Ericsson Showcase Pre-6G Network Technology

Keysight and Ericsson Showcase Pre-6G Network Technology

A groundbreaking prototype for an early 6G network has been unveiled, showcasing the innovative collaboration between Ericsson and Keysight Technologies. This pioneering project utilizes Ericsson's pre-standard protocol stack, specifically designed for new spectrum bands, in conjunction with a test system from Keysight....

Published on: June 07, 2024

Raspberry Pi Unveils CM5 Compute Module

Raspberry Pi Unveils CM5 Compute Module

Early customers are currently getting their hands on the highly anticipated Raspberry Pi CM5 compute module. This new iteration boasts significant upgrades over its predecessor, the CM4, promising enhanced performance and capabilities.The Raspberry Pi CM5 is powered by the cutting-edge 16nm BCM2712...

Published on: June 07, 2024

UK and US Collaborate on Essential Patents

UK and US Collaborate on Essential Patents

The UK and US governments have recently come together to sign a significant deal that covers essential patents for the next five years. This memorandum of understanding (MOU) was signed on June 3, 2024, by Under Secretary of Commerce for Intellectual Property...

Published on: June 07, 2024

Samsung Utilizes Cadence Digital Twin Tech for 3D IC Thermal Analysis

Samsung Utilizes Cadence Digital Twin Tech for 3D IC Thermal Analysis

Samsung and Cadence have recently announced a groundbreaking partnership aimed at utilizing digital twin technology for 3D-IC thermal management. This innovative initiative is set to revolutionize the field of advanced packaging and thermal control for 3D-ICs, addressing critical challenges in the industry.With...

Published on: June 07, 2024

Unlocking Energy Storage with Rust

Unlocking Energy Storage with Rust

Iron-air batteries, a groundbreaking innovation in the field of energy storage, have been making waves in the industry. These batteries work by oxidizing iron, essentially creating rust, to generate electricity. The unique feature of these batteries lies in their ability to be...

Published on: June 07, 2024

Breakthrough: Chip-Based 3D Printer Unveiled by Researchers

Breakthrough: Chip-Based 3D Printer Unveiled by Researchers

Imagine a portable 3D printer you could hold in the palm of your hand. The tiny device could enable a user to rapidly create customized, low-cost objects on the go, like a fastener to repair a wobbly bicycle wheel or a component...

Published on: June 07, 2024

Siemens Enhances Software Verification Tool with Formal Methods

Siemens Enhances Software Verification Tool with Formal Methods

Siemens Digital Industries Software has introduced two groundbreaking enhancements in C++ software verification, marking a significant advancement in the field. The latest iteration of the Catapult tool now incorporates C++ formal property checking and reachability coverage analysis, offering a comprehensive solution for...

Published on: June 06, 2024

Next-Gen SiC Powers AI Data Centers and EV Charging

Next-Gen SiC Powers AI Data Centers and EV Charging

Navitas Semiconductor has introduced a groundbreaking series of silicon carbide (SiC) switches designed specifically for data center and automotive applications. The Gen-3 ‘Fast’ (G3F) 650 V and 1200 V SiC MOSFETs developed by Navitas have been engineered to deliver higher switching speeds...

Published on: June 06, 2024

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