Baya Systems Unveils Chiplet Interconnect Technology

Baya Systems, a cutting-edge technology company, has recently emerged from stealth mode with a revolutionary interconnect tool tailored for chiplet and complex system on chip (SoC) designs. According to Nandan Nayampally, the chief commercial officer of Baya Systems, the company's approach emphasizes a software-driven development process, marking a significant shift in the industry. Nayampally describes their offering as the first truly focused fabric for artificial intelligence (AI), setting a new standard in the field.

The team behind Baya Systems comprises top executives from leading tech companies such as Intel, Netspeed Systems, ARM, Brainchip, AMD, and Nuvia. Renowned microprocessor expert Jim Keller, who also serves as the CEO of AI chip developer Tenstorrent, chairs the company. With backing from Matrix and Intel Capital, Baya Systems is well-positioned to drive innovation in the semiconductor industry.

One of the key products introduced by Baya Systems is the WeaveIP, a comprehensive solution that enables the construction of a unified fabric with an efficient and scalable transport architecture. This architecture is designed to optimize performance and throughput while minimizing latency, silicon footprint, and power consumption. The WeaveIP supports standard protocols like CHI, ACE5-Lite, and AXI5, with the flexibility to extend to other protocols, including CXL.

Furthermore, the WeaverPro tool provided by Baya Systems offers support to SoC designers throughout the entire design process, from initial specification to post-silicon tuning. By leveraging the WeaveIP technology, designers can implement a unified mesh fabric approach that eliminates the need for translation gaskets, thereby enhancing performance and efficiency.

Dr. Sailesh Kumar, the CEO of Baya Systems, highlighted the critical role of the company's software-driven approach in addressing the challenges faced by the semiconductor industry. With a focus on future-proof multi-cluster and multi-chiplet designs, Baya Systems aims to revolutionize the market by delivering a groundbreaking fabric solution and methodology that streamlines design complexity and enhances energy efficiency. The company's vision aligns with the evolving needs of the industry, positioning them as a key player in the semiconductor landscape.