Frontgrade Technologies and processor supplier Vorago Technologies have joined forces to develop scalable AI platforms tailored for autonomous space systems. The collaboration aims to create reference designs based on Vorago’s space-certified processors, enabling in-orbit autonomy, real-time data processing, and advanced AI capabilities.Moreover,...
Published on: May 25, 2025
WiBotic, a company based in Seattle, Washington, has recently completed the delivery of a cutting-edge wireless charging system tailored for a Moon rover currently in development by Astrobotic. This significant milestone marks a crucial step forward in advancing space exploration technology.Astrobotic has...
Published on: May 23, 2025
Taiwanese foundry chip maker TSMC has issued a warning to the administration of President Trump regarding the potential impact of import tariffs on chips. The company stated that if the US imposes such tariffs, or fails to provide an exemption, it may...
Published on: May 23, 2025
EnSilica, a leading provider of semiconductor solutions, has recently unveiled two cutting-edge Ku-band beamformer ICs, the ENS92051 and ENS92052. These innovative ICs have been specifically engineered to cater to the evolving demands of the next generation of electronically steered antennas utilized in...
Published on: May 22, 2025
Silicon Labs has introduced the first products of its Series 3 portfolio, unveiling two new wireless SoC families, the SiXG301 and SiXG302, built on the advanced 22-nm process node. These wireless SoCs mark a significant leap in computing power, integration, security, and...
Published on: May 22, 2025
The electronics and chip markets in 1Q25 experience typical seasonality with warnings of atypical shiftsAccording to SEMI, the market for electronics goods declined by 16 percent sequentially in 1Q25 but remained flat compared to the same quarter the previous year. This data,...
Published on: May 22, 2025
NXP Semiconductors has introduced the second generation of its OrangeBox development platform, designed to facilitate secure communication between a vehicle’s gateway and its wireless technologies. Known as OrangeBox 2.0, this platform boasts a significant 4x increase in CPU performance compared to its...
Published on: May 21, 2025
iC-Haus GmbH has introduced the iC-LFMB to its existing iC-LF product family of linear image sensors, targeting demanding industrial applications. The iC-LFMB optical linear image sensor stands out for its expanded photosensitive area, achieved through its unique pixel geometry. Featuring 64 active...
Published on: May 21, 2025
The 2025 Thales Data Threat Report highlights that nearly 70% of organizations are concerned about the rapid advancement of AI, especially in generative AI, as the primary security issue related to its adoption. This concern is closely followed by worries about integrity...
Published on: May 20, 2025
TDK has recently expanded its multilayer chip bead range specifically designed for automotive power supply lines by introducing the MPZ1608-PH chip bead. This new addition to the lineup is capable of handling currents of up to 8A, making it a valuable component...
Published on: May 20, 2025