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SK Hynix surpasses Samsung in DRAM revenue as Q1 sees 5.5% decline

SK Hynix surpasses Samsung in DRAM revenue as Q1 sees 5.5% decline

Samsung’s position in the semiconductor industry faces a new challenge as sk Hynix surpasses it to become the world’s largest supplier of DRAM memory chips. According to the latest data from TrendForce, the global revenue for the DRAM industry in 1Q25 reached...

Published on: June 03, 2025

“GPU Dominance in Edge AI Over NPUs”

“GPU Dominance in Edge AI Over NPUs”

Artificial Intelligence (AI) isn’t just a technological breakthrough — it’s a permanent evolution in how software is written, understood, and executed. Traditional software development, built on deterministic logic and largely sequential processing, is giving way to a new paradigm: probabilistic models, trained...

Published on: May 30, 2025

Broadband Forum enhances Thread communications

Broadband Forum enhances Thread communications

The Broadband Forum has recently released an updated specification aimed at providing broadband service providers (BSPs) with enhanced visibility and control over devices and applications connected via a Thread network. The Broadband Forum TR-181 data model — Device:2.19 — has undergone revisions...

Published on: May 29, 2025

J-link support for 48V automotive microcontrollers

J-link support for 48V automotive microcontrollers

Segger, a company based in Germany, has recently collaborated with Allegro MicroSystems to provide support for 48V-capable microcontrollers used in motor control applications within the automotive industry. This partnership enables Segger’s J-Link debug probes to be utilized for downloading programs into and...

Published on: May 29, 2025

Rust on Embedded Online Conference: Build Safe Embedded Systems with Rust

Rust on Embedded Online Conference: Build Safe Embedded Systems with Rust

Discover on 16 May 2025 how Rust can make embedded systems safer, faster, and more reliable – with expert-led practical presentations.On Wednesday, 16 July 2025, Elektor Academy Pro will host a full-day online conference dedicated to the programming language Rust and its...

Published on: May 29, 2025

Configurable Driver Enhances Safety with Additional Limp Home Mode Pins

Configurable Driver Enhances Safety with Additional Limp Home Mode Pins

STMicroelectronics has introduced a new driver featuring eight high-side and low-side channels equipped with diagnostics, protection, and hardware-controlled limp-home functionality. The L9026 driver offers six configurable high-side/low-side outputs along with two high-side outputs in an HTSSOP package and a compact 5mm x...

Published on: May 28, 2025

EU to Address Innovation Issue Through EIC Overhaul

EU to Address Innovation Issue Through EIC Overhaul

The European Commission is taking steps to enhance and modernize the European Innovation Council (EIC) in a manner similar to the Advanced Research Projects Agency (ARPA) in the United States, with the goal of providing increased support for startup and scaleup companies.This...

Published on: May 28, 2025

Exploring OpenAi io Appliance

Exploring OpenAi io Appliance

The acquisition of io by OpenAI for $6.5 billion, founded by British iPhone designer Jony Ive, has paved the way for portable AI technology. The startup has already unveiled a prototype that has caught the attention of OpenAI CEO Sam Altman. While...

Published on: May 27, 2025

ams Osram Wins Trade Secrets Case After 17 Years, Loses Money

ams Osram Wins Trade Secrets Case After 17 Years, Loses Money

After 17 years of legal battles, ams-Osram in Austria has emerged victorious in a case against Renesas Electronics, albeit with a reduced settlement amount following an appeal. The case, which involved allegations of trade secrets theft, breach of contract, and patent infringement,...

Published on: May 27, 2025

EV Group Enhances Digital Lithography for AI Chiplet Packaging

EV Group Enhances Digital Lithography for AI Chiplet Packaging

The EV Group in Austria has developed a maskless digital lithography system that is five times faster than previous systems for high volume AI chiplet assembly.The Lithoscale XT maskless exposure (MLE) system supports heterogeneous integration applications such as chiplets and high bandwidth...

Published on: May 27, 2025

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