September’s Top Picks on eeNews

September was a month filled with exciting developments in the tech industry, with a diverse range of articles capturing the attention of enthusiasts and professionals alike.

Lumotive made waves by introducing an open development kit for its automotive metasurface material, paving the way for innovative applications in the automotive sector. Meanwhile, in France, Greenerwave unveiled its reconfigurable intelligent surface (RIS) for next-generation 6G networks, signaling a significant step forward in the realm of connectivity.

NXP solidified its position in the market with a strategic deal with Raam, focusing on the development of a replacement for SRAM memory. Simultaneously, the Glass Substrate Alliance was established, aiming to provide a cost-effective platform for chiplet designs, which could revolutionize the semiconductor industry.

Maritime Robotics secured a substantial $12 million in funding for its autonomous ship technology, underscoring the growing interest in autonomous systems. On the other hand, ST unveiled its fourth generation of 750V and 1200V silicon carbide (SiC) power devices, catering to the burgeoning electric vehicle market.

AMD made headlines by streamlining its packaging for automotive FPGAs, showcasing its commitment to enhancing performance and efficiency. However, concerns loomed over Europe's vulnerability to the impending semiconductor downturn, as highlighted by industry expert Malcolm Penn from Future Horizons.

Despite the array of advancements, it was the challenges faced by Intel that took center stage in September. The departure of a group of Intel CPU architects to establish a startup focusing on RISC-V chip designs raised eyebrows in the industry. Additionally, Intel's decision to halt its manufacturing plans in Germany sparked discussions about the company's future direction and competitiveness in the global market.