ST extends its metasurface optics deal

STMicroelectronics has recently announced a new license agreement with Metalenz to expand the integration of metasurface optics IP into a broader range of sensors. The company has been utilizing metalens technology for its AI-enabled time of flight (ToF) sensors, manufacturing the flat lenses on the same 300mm wafers as the analog sensor. This new agreement paves the way for ST to enter high-volume consumer, automotive, and industrial markets, showcasing the potential for significant growth and innovation.

By leveraging Metalenz IP, ST enhances its capabilities to produce advanced metasurface optics on its existing manufacturing platform, which combines 300mm semiconductor and optics production, test, and qualification processes. This strategic move positions ST as a unique supplier in the market, offering a groundbreaking fusion of optics and semiconductor technology. Since 2022, ST has shipped over 140 million metasurface optics and FlightSense modules using Metalenz IP, demonstrating the successful collaboration between the two companies.

• Metalenz, UMC launch metalens tech onto the open market
• Metalens taps AI to improve ultra-thin imaging lens

According to Alexandre Balmefrezol, Executive Vice President and General Manager of ST’s Imaging Sub-Group, “The new license agreement with Metalenz strengthens our technology leadership in consumer, industrial, and automotive segments, unlocking new possibilities in smartphone applications such as biometrics, LIDAR, camera assist, robotics, gesture recognition, and object detection. Our unique model of processing optical technology in our 300mm semiconductor fab ensures precision, cost-effectiveness, and scalability to meet the demands of our customers for high-volume, complex applications.”

Rob Devlin, co-founder and CEO of Metalenz, expressed optimism about the collaboration with STMicroelectronics, stating, “Our agreement has the potential to accelerate the adoption of metasurfaces from their inception at Harvard to widespread use by leading consumer electronics companies. By shifting optics production into semiconductor manufacturing, this partnership has the power to redefine the sensing ecosystem. As the applications for 3D sensing continue to grow, ST’s technology leadership combined with our IP leadership solidifies ST and Metalenz as key players in the emerging metasurface market.”

Established in 2016 as a spin-off from Harvard, Metalenz holds exclusive license rights to the foundational Harvard metasurface patent portfolio. The technology replaces traditional lens stacks with enhanced optical performance and temperature stability while reducing size and complexity. In a significant move last year, Metalenz partnered with Taiwanese foundry UMC to bring the technology to the open market, collaborating with customers like Vertilite for structured light sensors.