US Invests $3bn in Packaging Innovation and Manufacturing

US Allocates $3 Billion to National Advanced Packaging Manufacturing Program

The US government has allocated $3 billion of Chips Act funding to its National Advanced Packaging Manufacturing Program (NAPMP) in an effort to drive innovation and accelerate the transition of advanced packaging technologies to US manufacturing entities. The goal is for the US to become a global leader in both chip manufacturing and packaging within the next decade.

"Within a decade, we envision that America will both manufacture and package the world's most sophisticated chips," said Laurie Locascio, director of the US National Institute of Standards and Technology (NIST). "This means onshoring a high-volume advanced packaging industry that is self-sustaining, profitable, and environmentally sound, as well as conducting research to accelerate new packaging approaches to market."

The "Vision for the National Advanced Packaging Manufacturing Program" (NAPMP) outlines the vision, mission, and objectives of the advanced packaging program established by the Chips Act. The program aims to create a vibrant, self-sustaining, high-volume domestic advanced packaging industry, where advanced-node chips manufactured in the US are also packaged in the US.

Advanced packaging refers to the integration of multiple silicon die with a large number of interconnects, blurring the line between chip and package. The NAPMP will invest in various areas, including design and simulation tools, manufacturing equipment and processes, research and development in materials and substrates, power delivery, and thermal management for advanced packaging assemblies. It will also focus on the development of a chiplet ecosystem and co-design of multi-chiplet subsystems with automated tools adapted for advanced packaging, taking into consideration factors such as built-in test and repair, security, interoperability, and reliability.

To support the transition of these advancements into high-volume manufacturing, the Advanced Packaging Piloting Facility (APPF) will be established. The APPF will serve as a hub for testing and scaling up new packaging technologies, ensuring their successful integration into the manufacturing process.