News Archive

Intel focuses on agentic AI with Xeon 6+ and Ethernet enhancements

Intel focuses on agentic AI with Xeon 6+ and Ethernet enhancements

Intel has recently introduced a new range of data center hardware designed to support the growing prevalence of agentic AI. This update encompasses enhancements across CPUs, networking solutions, and upcoming AI accelerators. The company emphasizes the significance of CPUs as the central...

Published on: June 03, 2026

Siemens and partners collaborate on NVIDIA AI data center reference architecture

Siemens and partners collaborate on NVIDIA AI data center reference architecture

Siemens, in collaboration with NVIDIA, Fluence, and nVent, has joined forces to develop a cutting-edge reference architecture tailored for next-generation AI data centers centered around NVIDIA’s DSX Vera Rubin NVL72 platform. This innovative design targets hyperscalers, colocation operators, and cloud providers seeking...

Published on: June 03, 2026

NVIDIA Microsoft Stack Targets Windows Agentic AI

NVIDIA Microsoft Stack Targets Windows Agentic AI

NVIDIA and Microsoft have come together at Microsoft Build to enhance the integration of Windows in both local and cloud-based agentic AI development. This collaboration introduces a comprehensive accelerated computing stack that includes RTX Spark PCs, DGX Station for Windows, Azure Local,...

Published on: June 03, 2026

“NVIDIA and TSMC Advance AI in Semiconductor Fabs”

“NVIDIA and TSMC Advance AI in Semiconductor Fabs”

NVIDIA and TSMC have announced an expansion of their partnership to integrate AI and accelerated computing directly into semiconductor manufacturing processes. This collaboration aims to enhance chip production speed, increase yields, and optimize fab operations. The move underscores the growing importance of...

Published on: June 02, 2026

AI data centres power trends at PCIM

AI data centres power trends at PCIM

Power is playing an increasingly crucial role in the design of various systems, ranging from AI data centers to e-mobility, drones, and robotics. The demand for more efficient power systems with higher levels of integration is evident at the PCIM conference and...

Published on: June 01, 2026

Nextpower Prevalon acquisition expands BESS

Nextpower Prevalon acquisition expands BESS

Nextpower is expanding its reach beyond solar power through the acquisition of battery energy storage specialist Prevalon Energy, a move that will enhance its presence in the rapidly growing markets for energy storage and AI data center infrastructure. The company anticipates that...

Published on: June 01, 2026

ROHM adds PLECS simulator for power design checks

ROHM adds PLECS simulator for power design checks

ROHM has introduced the ROHM PLECS Simulator on its website, providing power electronics engineers with a convenient browser-based tool for evaluating ROHM power devices in the early stages of circuit design. This tool, which is built on PLECS simulation software, emphasizes quick...

Published on: May 31, 2026

TP Link focuses on reliability with Archer 8 WiFi platform

TP Link focuses on reliability with Archer 8 WiFi platform

TP Link has introduced Archer 8, its inaugural WiFi 8 router platform, emphasizing reliability and low latency as key features in the evolution of home networking. The platform is built on the emerging IEEE 802.11bn standard and is set to debut in...

Published on: May 29, 2026

Engineer Frustrations: System Check

Engineer Frustrations: System Check

When working on an engineering project, frustrations can arise from various sources. From technical challenges to logistical issues, engineers often face obstacles that can impede progress. Identifying the most significant root cause of project delays is crucial for improving efficiency and productivity...

Published on: May 29, 2026

SEMI And Global Net Corp. Predict Strong Growth for Glass Core Substrates in AI Packaging

SEMI And Global Net Corp. Predict Strong Growth for Glass Core Substrates in AI Packaging

SEMI and Global Net Corp. (GNC) have released a new report pointing to strong long-term growth for glass core substrates as chipmakers look for new ways to support AI and high-performance computing (HPC) workloads.The report, titled Glass Core Substrate Market and Development...

Published on: May 29, 2026

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