News Archive
Tower Semiconductor and Axiro collaborate on high-efficiency SiGe for advanced radar
Tower Semiconductor and Axiro Semiconductor have collaborated to introduce a new family of high-performance silicon germanium (SiGe) beamforming ICs tailored for next-generation U.S. defense systems. These devices, currently in the process of ramping up production, are specifically designed for radar and satellite...
UL Solutions builds new testing lab in Germany
UL Solutions is expanding its presence in Europe with a new testing lab in Germany. The company has begun construction of an electromagnetic compatibility and wireless testing facility in Neu-Isenburg. This new site will support larger and more complex connected systems across...
TSMC SoIC Roadmap Targets 2029 Chip Stacking
Advanced packaging is playing an increasingly crucial role in the performance scaling of AI and high-performance computing designs, with TSMC leading the way in pushing its 3D chip-stacking roadmap towards finer interconnect pitches and tighter integration. The updated TSMC SoIC roadmap, unveiled...
Robotics Development Platform Connects EBV Ecosystem for System Design
EBV Elektronik has recently unveiled MOVE, a cutting-edge robotics development platform aimed at providing engineers with access to embedded technologies, supplier resources, and application guidance for the creation of next-generation robotic systems. Developed by EBV Elektronik’s Embedded Solutions team, this initiative serves...
onsemi and Geely expand SiC collaboration for next-gen EV platforms
onsemi and Geely Auto Group have announced an expansion of their strategic collaboration to accelerate the development of next-generation electric and hybrid vehicles. This move focuses on integrating silicon carbide (SiC) technologies more deeply into future vehicle platforms. For readers of eeNews...
SK hynix starts mass production of 192GB AI server memory
SK hynix has commenced mass production of a cutting-edge 192GB SOCAMM2 memory module, aimed at next-generation AI servers and paving the way for more efficient, high-performance infrastructure.The newly developed module is based on the company’s 1cnm (sixth-generation 10nm-class) LPDDR5X DRAM process and...
2Trust.AI and Carahsoft partner for AI governance in public sector
2Trust.AI has partnered with Carahsoft Technology Corp. to introduce AI governance and compliance tools to public sector organizations, specifically targeting agencies facing stricter regulatory demands. This collaboration positions Carahsoft as the distributor of 2Trust.AI’s platform through its extensive reseller network and contract...
MATCH Act targets chip tool exports to China
A bipartisan US bill aimed at tightening semiconductor export controls on China is making progress through the House Foreign Affairs Committee, with lawmakers looking to enhance the restrictions by enshrining them in law rather than relying solely on the discretion of the...
Altilium EV Battery Recycling Expands with New Investment Round
Altilium EV battery recycling is gaining momentum as the UK-based clean tech company launches a new investment round on Republic Europe. Backed by a recent £18.5 million UK government grant, the company is aiming to scale its domestic recycling capacity and strengthen...
Credo to reveal AI interconnect solutions at TSMC 2026 Symposium
Credo Technology Group is gearing up to unveil its latest high-speed connectivity solutions for AI infrastructure at the TSMC 2026 Technology Symposium, commencing on April 22 in Santa Clara, California. The company is all set to participate in various symposium stops and...
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