News Archive
COM-HPC module for high performance edge AI
congatec in Germany has launched a COM-HPC Computer-on-Module (COM) for power-hungry edge and infrastructure applications.The conga-HPC/cBLS is based on the performance hybrid architecture of the Intel Core S processors (codenamed Bartlett Lake S) with up to 16 Efficient (E) and up to...
128 nozzle print head for semiconductor equipment
Scrona in Switzerland has shown its third generation print head with 128 nozzles for semiconductor advanced packaging, display manufacturing and consumer electronics.The electrohydrodynamic (EHD) print head was shown at the CES 2025 show in Las Vegas for the first time and marks...
Refrigeration breakthrough for superconducting quantum qubits
Researchers in Sweden and the US have developed a new type of refrigerator that can autonomously cool superconducting qubits to record low temperatures, paving the way for more reliable quantum computers.However, the time a quantum computer can work on a calculation is...
$5.4m for next generation FD-SOI beamforming transceiver
Sivers Semiconductors in Sweden has been awarded a major chip development project to develop a next generation highly-integrated millimetre wave beamforming transceiverThe $5.4m programme for a leading Tier-1 telecom infrastructure vendor will run until the end of 2026 and will use the...
Renesas develops split gate process for lower resistance 100V MOSFETs
Renesas Electronics has developed a process technology for high power 100V MOSFETs with a split gate that reduces the on-resistance between the drain and source by 30 percent to 1.5mΩ.The REXFET-1 process is being used for a series of n-channel 340A, 100V MOSFETs...
Vector signal generators offer enhanced EVM performance
Rohde & Schwarz has introduced the latest evolution of its two vector signal generators, the signature SMW200A for the most demanding applications, and its midrange counterpart, the best-in-class SMM100A.Besides a redesigned front panel and user interface, SMW200A signal generators have been equipped...
Two chip, 9-axis sensor for consumer wearables
TDK has launched a two chip, 9-axis sensor system for absolute orientation detection and fast sensor calibration at ultra-low power consumptionThe InvenSense PositionSense integrates TDK’s 6-axis IMU and TDK’s 3-axis TMR-based magnetometer, on-chip sensor fusion software, and off-chip pedestrian dead reckoning (PDR)...
MOSFETs deliver lower on-resistance in small footprint
Renesas Electronics Corporation has introduced new 100-V high-power N-Channel MOSFETs that deliver industry-leading high-current switching performance for applications such as motor control, battery management systems, power management and charging.The MOSFETS find applications in end products such as electric vehicles, e-bikes, charging stations,...
Dutch inventor develops groundbreaking medical projector
Dr. Stefan Hummelink invented a device that allows a doctor to project anatomical data directly onto a patient’s skin. The Anatomy Projector is the world’s first device of its kind – FHI reportThe projector makes it possible to operate faster, more reliably...
BrainChip launches edge AI box ecosystem
BrainChip has launched an ecosystem of applications to run on its Akida neuromorphic chip and box reference design.The software covers focussing on gestures, cybersecurity, image recognition and computer vision for manufacturing, warehouse, retail, hospitals, energy, automotive, and aviation. These run on the...
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