News Archive
Echion ramps niobium battery material rollout with another £10m
UK startup Echion Technologies has raised £10m (€12m, $12.6m) to accelerate the rollout of partners using its niobium-based material to make fast charging battery cells.The funding will also support Echion’s growth in key markets by providing additional resources to connect cell manufacturers...
VyperCore accelerator chip adopts Solid Sands for C/C++ compliance
VyperCore has chosen the SuperTest comprehensive testing and validation suite from Solid Sands to ensure compliance with C and C++ language standards for the development of their new accelerator chip.This collaboration on the accelerator chip will provide VyperCore with the highest quality levels when developing...
Startup Blueshift Memory launches low-power RISC-V core design
Blueshift Memory has announced a RISC-V processor reference design that addresses the twin problems facing the computing industry — the Memory Wall and the Energy Wall.The BlueFive™ RISC-V processor reference design achieves between five times and 50 times faster benchmarked calculation speed, depending...
Folded lens, a next-generation nano-optical device
Researchers from Seoul National University College of Engineering announced they have developed an optical design technology that dramatically reduces the volume of cameras with a folded lens system utilizing “metasurfaces,” a next-generation nano-optical deviceBy arranging metasurfaces on a glass substrate so that...
French photonics firm taps Qualcomm for new CEO
Scintil Photonics in France has appointed Matt Crowley as CEO as founder Sylvie Menezo moves to technology developments and customer partnershipsThe move will also boost the presence of the Gernoble-based photonic chip developer with a US subsidiary to support its expanding customer...
Eliyan ports chiplet interconnect to Samsung 4nm process
Eliyan has taped out of its NuLink chiplet on Samsung Foundry’s SF4X 4nm following a test chip on TSMC’s 3nm process.The Nulink PHY in a x64 UCIe Advanced Package Module will see initial silicon for characterization in Q1 2025.The high-performance chiplet interconnect...
5D imaging radar for L3+ systems
Provizio in Ireland has launched its 5D imaging radar system with over the air updates and support for processing camera and LiDaR data.The VizioR&I combines the Provizio 4D VizioPrime imaging radar with Nvidia’s Orin GPU for real-time all-weather perception and can be...
BYD Semiconductor shows automotive controller chips
BYD’s chip design spinout has been working with TSMC and Mediatek on a central automotive controller chip and a 4nm smart cockpit chip.The central controller chip designed by BYD Semiconductor is reported to have a performance of 80TOPS for its smart driving...
TSMC drives A16, 3D process technology
TSMC is looking to introduce its A16 1.6nm process by the end of 2026 with an IEEE standard for its 3Dblox technology.The Open Innovation Platform (OIP) meeting in the Netherlands this week showed that the 2nm process will be in production in...
Sony sensor quadruples performance for industrial imaging
Sony Semiconductor has launched a 25Mpixel image sensor with a global shutter at 394 frame/s for high speed industrial automation.The IMX925 stacked CMOS image sensor has a back-illuminated pixel structure with a high, 24.55-effective-megapixel count and is optimized for industrial equipment imaging.A...
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