News Archive

Esperanto Collaborates with Rapidus for Next-Gen AI

Esperanto Collaborates with Rapidus for Next-Gen AI

Esperanto, a leading technology company, has announced a strategic partnership with Rapidus, a semiconductor manufacturing company, with the goal of revolutionizing energy-efficient designs in the upcoming "post-GPU era." This collaboration is set to pave the way for more sustainable and high-performance solutions...

Published on: May 16, 2024

Quantic Electronics Acquires RF/Microwave Specialist M Wave Design

Quantic Electronics Acquires RF/Microwave Specialist M Wave Design

Founded in 1988, M-Wave has established itself as a premier designer and manufacturer of passive waveguide and coaxial components. These components include isolators, circulators, adapters, and terminations. With a strong focus on high power and low loss passive designs, M-Wave has a...

Published on: May 16, 2024

Cutting-Edge Single Pair Ethernet (SPE) Solutions for Smart Buildings

Cutting-Edge Single Pair Ethernet (SPE) Solutions for Smart Buildings

Stewart Connector, a leading provider of connectivity solutions, has unveiled a new line of jacks and cables specifically designed for Single Pair Ethernet (SPE) applications in smart buildings. This innovative technology enables both data and power transmission through Power over Data Line...

Published on: May 16, 2024

Climate Change’s Influence on Power Grids: A Modeling Approach

Climate Change’s Influence on Power Grids: A Modeling Approach

The Data & Analytics Facility for National Infrastructure (DAFNI) in the UK has recently approved three innovative projects as part of its energy sandpit programme. These projects aim to model the impact of climate change on power grids, focusing on various aspects...

Published on: May 16, 2024

Tachyum Introduces Beta UEFI with RAID Support

Tachyum Introduces Beta UEFI with RAID Support

Universal processor designer Tachyum has recently made significant advancements by moving its Unified Extensible Firmware Interface (UEFI) to beta and introducing RAID 1 redundant storage capabilities. This move marks a crucial step forward in enhancing the functionality and user experience of the...

Published on: May 16, 2024

Q-Pixel Unveils Stunning 6800 PPI Color MicroLED Display

Q-Pixel Unveils Stunning 6800 PPI Color MicroLED Display

Q-Pixel has made waves in the tech world by showcasing an active-matrix color display with an impressive 6800 pixels per inch (PPI), claiming the title of the world's highest resolution display. This breakthrough has been achieved through the innovative use of microLED...

Published on: May 16, 2024

Omnivision Introduces 5MP Sensor for Automotive TheiaCel Technology

Omnivision Introduces 5MP Sensor for Automotive TheiaCel Technology

Omnivision, a leading provider of advanced imaging solutions, has unveiled a groundbreaking high-dynamic range image sensor featuring TheiaCel technology. This cutting-edge sensor is designed to effectively mitigate LED flicker under any lighting condition, setting a new standard in image quality and performance.The...

Published on: May 15, 2024

TSMC to Introduce Automotive Chiplet Process by 2025

TSMC to Introduce Automotive Chiplet Process by 2025

TSMC, the leading semiconductor foundry, has announced its plans to introduce automotive qualified versions of its innovative 3D fabric chiplet technology by the end of 2025. This development marks a significant step forward in the company's efforts to cater to the specific...

Published on: May 15, 2024

Polestar Partners with IMSE for Innovative Molded Electronics

Polestar Partners with IMSE for Innovative Molded Electronics

Car manufacturer Polestar has taken a significant step towards enhancing the electronic components in its vehicles by licensing the cutting-edge Injection Molded Structural Electronics (IMSE) technology from TactoTek, a pioneering company based in Finland. This strategic move will enable Polestar to incorporate...

Published on: May 15, 2024

Boosted PCB Density with Extended Temperature Rating for Power Relays

Boosted PCB Density with Extended Temperature Rating for Power Relays

Omron Electronic Components Europe has recently made significant improvements to the temperature range of its Class-F coil insulation relays, aiming to enhance the PCB packing density. The latest addition to their product line, the G5NB-1A4-EL-HA-CF Class F power relay, is designed to...

Published on: May 15, 2024

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